Principal HBM Design Architect

Micron Technology
United States
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 7+ yearsEducation: bachelorsSkills: ["Analytical thinking","Problem-solving","Communication","Collaboration"]

Design and optimize digital, analog, and mixed-signal DRAM circuits for next-generation HBM memory products as part of the HBM Architecture Team. Own schematic entry, simulation, and optimization for key DRAM blocks, validate block- and full-chip functionality, and run feasibility studies for emerging HBM architectures. Collaborate across distributed engineering groups on floorplanning, layout reviews, cross-domain integration, and verification strategies to deliver reliable, high-performance HBM solutions.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

Principal HBM Design Architect

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Design and optimize digital, analog, and mixed-signal DRAM circuits for next-generation HBM memory products as part of the HBM Architecture Team. Own schematic entry, simulation, and optimization for key DRAM blocks, validate block- and full-chip functionality, and run feasibility studies for emerging HBM architectures. Collaborate across distributed engineering groups on floorplanning, layout reviews, cross-domain integration, and verification strategies to deliver reliable, high-performance HBM solutions.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Design and analyze digital, analog, and mixed-signal circuits for HBM DRAM products.
  • •Perform schematic entry, simulation, and optimization for DRAM blocks including data path, ECC, command control, and clocking circuits.
  • •Evaluate full-chip and block-level functionality and deliver solutions ensuring functional accuracy.
  • •Conduct pathfinding and feasibility studies for next-generation HBM architectures.
  • •Optimize circuit timing, area, power, and complexity, and support design floor planning, layout reviews, and cross-domain integration.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •BSEE with 7+ years of relevant engineering experience, or MSEE with 5+ years of relevant engineering experience.
  • •Strong knowledge of CMOS circuit design and semiconductor device physics.
  • •Hands-on experience with schematic entry and simulation tools such as Finesim and HSPICE.
  • •Experience with power distribution and power network analysis.
  • •Proficiency with scripting languages such as Python, Tcl, or Perl.
Experience:7+ yearsSemiconductorsDRAMHBMMixed-signal design
Education:Bachelor's
Skills:Analytical thinkingProblem-solvingCommunicationCollaboration
Tech Stack:HBMDRAMCMOSFinesimHSPICEPythonTclPerl

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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