Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 4+ yearsSkills: ["Data analysis","Debugging","Technical problem solving","Communication","Independent work"]

Provide technical leadership across Micron’s global network to improve yield, product quality, and benchmark performance for New Product Introduction (NPI). You’ll integrate cross-site project data spanning design, test, yield, front-end manufacturing, and packaging/BEOL interaction, lead task forces to resolve yield/quality issues, and standardize best-known methods to scale improvements. Work with teams across the U.S., Japan, Taiwan, and Singapore and travel to support execution alignment.

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Micron Technology
Micron Technology
2 days ago

Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

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Job Summary

Provide technical leadership across Micron’s global network to improve yield, product quality, and benchmark performance for New Product Introduction (NPI). You’ll integrate cross-site project data spanning design, test, yield, front-end manufacturing, and packaging/BEOL interaction, lead task forces to resolve yield/quality issues, and standardize best-known methods to scale improvements. Work with teams across the U.S., Japan, Taiwan, and Singapore and travel to support execution alignment.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead global product integration efforts to improve yield, quality, and benchmark performance across technologies and products.
  • •Integrate and drive execution of cross-site project data (design, test, yield, manufacturing) to closure.
  • •Deliver yield improvements using end-to-end understanding of product design, test flow, packaging interaction, and manufacturing reliability requirements.
  • •Define and execute strategies to ensure Packaging Technology and Chip-Package Interaction readiness ahead of product qualification.
  • •Lead cross-functional global task forces to resolve yield and quality issues; develop, standardize, and deploy best-known methods and communicate risks and proposals clearly.
Travel: High travel

Pay and Benefits

Perks:Health InsurancePaid LeaveLearning BudgetWellness Stipend

Key Requirements

  • •Bachelor’s or Master’s in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
  • •4+ years of experience in product integration, test, yield, design engineering, or BEOL semiconductor process integration.
  • •Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
  • •Proven ability in data analysis, debugging, and technical problem solving, with strong written and verbal communication skills.
  • •Ability to work independently in a cross-functional global environment, manage multiple priorities, and travel 20–50%.
Experience:4+ years
Education:
Skills:Data analysisDebuggingTechnical problem solvingCommunicationIndependent work

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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