Substrate Packaging Defect Metro Tool Owner
Phoenix
Workplace: OnsiteFull timeUSD 103,730 - 198,820 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 3+ yearsEducation: bachelorsSkills: ["Independent work","Problem-solving","Leadership","Adaptability","Data communication"]Drive defect metrology and yield improvement for Intel’s substrate packaging and panel-level assembly test manufacturing. You’ll use defect inspection tools to detect and resolve process issues, apply real-time data analysis and DOE summaries, and lead next-generation tool installation milestones from spec through qualification. Partner with factory and module teams to maintain WIP velocity, set up data flows to automation and yield systems, and present tool capabilities and insights to APTM leadership.
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