Principal Foundry Interface Design Engineer, HBM

Micron Technology
California, Texas
Workplace: OnsiteFull timeUSD 146,000 - 297,000 annuallyFunction: Design (Product/UX/UI/Visual)Experience: 6+ yearsSkills: ["Deep technical collaboration","Cross-functional communication","Problem-solving","Knowledge sharing","Process optimization"]

Support the HBM Design Architecture team by translating foundry process capabilities into scalable, high-performance HBM DRAM architectures. Serve as a technical bridge across Micron design teams, foundry partners, and technology development groups. Execute circuit simulations (HSPICE), validate via test chips and post-silicon analysis, evaluate PDKs and design enablement, and identify AI-enabled workflows to improve DTCO, foundry interface, and PDK evaluation efficiency.

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Micron Technology
Micron Technology
3 days ago

Principal Foundry Interface Design Engineer, HBM

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Job Summary

Support the HBM Design Architecture team by translating foundry process capabilities into scalable, high-performance HBM DRAM architectures. Serve as a technical bridge across Micron design teams, foundry partners, and technology development groups. Execute circuit simulations (HSPICE), validate via test chips and post-silicon analysis, evaluate PDKs and design enablement, and identify AI-enabled workflows to improve DTCO, foundry interface, and PDK evaluation efficiency.
Location: California, Texas
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Sr. Manager level

Key Responsibilities

  • •Act as the primary technical interface between foundry partners and Micron design organizations, driving closure of design-process gaps with foundry process teams.
  • •Define technology requirements and influence foundry roadmaps related to TSV, BEOL, reliability, and design enablement for future HBM and custom memory products.
  • •Perform HSPICE simulations for technology evaluation and design optimization, including compact model/PDK SPICE evaluation, process-corner analysis, and pre/post-layout circuit analysis.
  • •Plan and execute test-chip and silicon validation: define process monitors/benchmark vehicles, analyze post-silicon data, and correlate results with simulations.
  • •Evaluate foundry PDKs and IP collateral, support design enablement with technology guidelines and design recommendations, and identify AI-enabled automation/knowledge-management improvements across DTCO and PDK evaluation.

Pay and Benefits

Salary: USD 146,000 - 297,000 annually
Perks:Health InsurancePaid LeavePaid HolidaysLearning BudgetWellness Stipend

Key Requirements

  • •6+ years of semiconductor industry experience with advanced semiconductor technology development.
  • •Strong understanding of advanced CMOS technology nodes, FinFET devices, and process integration.
  • •Hands-on experience with HSPICE simulations, device characterization, standard cell benchmarking, PPA analysis, and parasitic extraction/physical verification.
  • •Experience in driving AI-enabled engineering practices and automation for DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and knowledge sharing.
  • •BS, MS, or PhD in Electrical Engineering, Computer Engineering, or a related field, or equivalent experience.
Experience:6+ yearsSemiconductorsMemoryHBMDRAM
Education:
Skills:Deep technical collaborationCross-functional communicationProblem-solvingKnowledge sharingProcess optimization
Tech Stack:HBMHBM DRAMDRAMHSPICESPICEPDKPDK SPICETSVBEOLCMOSFinFETHSPICE simulationsCompact modelsProcess cornersPre-layout analysisPost-layout circuit analysisRouting studiesTest chipsProcess monitor structuresBenchmark vehicles

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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