Principal Engineer, Package Silicon Integration

Micron Technology
Boise, Idaho
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsEducation: bachelorsSkills: ["Collaboration","Technical problem-solving","Cross-functional influence","Communication"]

Drive silicon and chip/package integration strategies within the Package Development Engineering team. Partner across global engineering groups to develop CPI package design guidelines, maintain technology roadmaps, and provide technical feedback on reliability and electrical validation plans. Establish methods to monitor end-to-end CPI health across product lifecycles, support test vehicle and reliability characterization, and perform CPI risk assessments and mitigation. Use AI-enabled tools and create AI agents to accelerate learning and streamline workflows.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
1 week ago

Principal Engineer, Package Silicon Integration

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Drive silicon and chip/package integration strategies within the Package Development Engineering team. Partner across global engineering groups to develop CPI package design guidelines, maintain technology roadmaps, and provide technical feedback on reliability and electrical validation plans. Establish methods to monitor end-to-end CPI health across product lifecycles, support test vehicle and reliability characterization, and perform CPI risk assessments and mitigation. Use AI-enabled tools and create AI agents to accelerate learning and streamline workflows.
Location: Boise, Idaho
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop systems/methods for monitoring end-to-end CPI health using AI-enabled tools.
  • •Lead CPI package design rules in the package design rule management system and maintain CPI design rule manuals for flip chip, wire bond, and 3DS packages.
  • •Create and maintain technology roadmaps and present them as needed.
  • •Support CPI test vehicle development and reliability characterization efforts as needed.
  • •Collaborate with engineering and quality teams to identify NUDDs, assess CPI risks, and propose risk mitigation solutions; compile summaries from diverse data sources using AI agents.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Time-offEquityWellness StipendLearning Budget

Key Requirements

  • •Bachelor’s degree or higher in Materials, Mechanical, Chemical, or Electrical Engineering.
  • •5+ years of relevant industry experience.
  • •Experience with chip package interactions and 1st level chip interconnect reliability.
  • •Experience with component package materials, BOM selection, and package assembly.
  • •Excellent communication skills to convey sophisticated technical concepts to technical and non-technical partners.
Experience:5+ yearsSemiconductorsMemoryStorageChip packagingReliabilityNAND/DRAM
Education:Bachelor's
Skills:CollaborationTechnical problem-solvingCross-functional influenceCommunication
Tech Stack:AI-enabled toolsAI agentsPackage design rule management systemE2E monitoringFlip chipWire bond3DS packages

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn