Silicon Packaging Technician, Silicon Assembly (Starlink)

SpaceX
United States
Workplace: OnsiteFull timeFunction: Field Service, Maintenance & Skilled TradesExperience: 3+ yearsEducation: certificationSkills: ["Manual dexterity","Process control","Attention to detail","Ability to follow safety protocols","Physical stamina"]

Operate and maintain silicon packaging and assembly equipment for Starlink, including deposition, photolithography, etching, dicing, molding, die attach, and electrochemical plating processes. Monitor and control process performance using in-situ sensors and metrology tools to ensure film uniformity, contamination control, and reliable production throughput. Follow cleanroom, chemical safety, and ESD protocols while producing high-quality semiconductor components at scale.

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FursaFursa
SpaceX
SpaceX
2 months ago

Silicon Packaging Technician, Silicon Assembly (Starlink)

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Last checked: 11 hours agoStatus: Live

Job Summary

Operate and maintain silicon packaging and assembly equipment for Starlink, including deposition, photolithography, etching, dicing, molding, die attach, and electrochemical plating processes. Monitor and control process performance using in-situ sensors and metrology tools to ensure film uniformity, contamination control, and reliable production throughput. Follow cleanroom, chemical safety, and ESD protocols while producing high-quality semiconductor components at scale.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Field Service, Maintenance & Skilled Trades
Seniority: Mid level

Key Responsibilities

  • •Operate and maintain deposition systems to deposit thin films of metals and dielectrics, and run stripping and etching equipment.
  • •Operate photolithography tools to apply resist layers, align products, expose patterns, and develop images with precision accuracy.
  • •Monitor process performance using in-situ sensors and metrology equipment to ensure film uniformity, step coverage, and contamination control.
  • •Perform wafer/panel singulation using dicing saws, laser dicers, and plasma etching tools following monitoring recipes.
  • •Run molding, die attach, and electrochemical plating processes to achieve target mold fill, manage voids/flash, and secure dies to micron-level accuracy while complying with cleanroom, chemical safety, and ESD standards.

Key Requirements

  • •High school diploma or equivalency certificate.
  • •3+ years of professional experience in a hands-on manufacturing environment, or an associate's degree in an engineering, math, or science discipline.
  • •Proficiency in photolithography (align, bake, coat, expose, develop), electrochemical plating, die attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe and break, stripping/etching, plasma, and RIE.
  • •Proficiency in data analysis and process control software for statistical process control (SPC).
  • •Physical stamina to manage equipment in a cleanroom suit and handle sensitive substrates.
Experience:3+ yearsSemiconductor manufacturing
Education:Certification / Diploma
Skills:Manual dexterityProcess controlAttention to detailAbility to follow safety protocolsPhysical stamina
Languages:English
Tech Stack:Physical vapor deposition (PVD)PhotolithographyPhotoresist coatersAlignersSteppersScannersDevelopers3D profilometersEllipsometersReflectometersX-ray fluorescence (XRF)Dicing sawsLaser dicersPlasma etchingMolding systemsDie attachEpoxy dispensersPick-and-place bondersReflow stationsElectrochemical plating

Eligibility

Nationality:US National

Company Brief

SpaceX
Designs, manufactures, and launches advanced rockets and spacecraft for commercial and government customers, aiming to reduce space transportation costs and enable human life on Mars through reusable launch vehicles and integrated space systems.
Industry: Aerospace Manufacturing
Company Size: Enterprise (1,001+ employees)
Growth: Established Company
Valuation: Hectocorn (USD 100B+)
Funding: Series E+
Headquarters: Hawthorne, United States
Founded: 2002
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