Senior Engineer, Unit Process Modeling

Micron Technology
Hyderabad, Telangana, India
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: phdSkills: ["Debugging","Problem-solving","Written communication","Verbal communication","Team collaboration"]

Develop and deploy digital twins and predictive/physics-informed models for semiconductor unit process domains to support fab-technology co-optimization. Build structural and multiphysics models to evaluate process-to-performance interactions and reliability risks, and create composite AI models for yield improvement, reliability assessment, and design-space exploration. Leverage computational methods, machine learning, GenAI/LLM copilots, RAG systems, and agentic AI workflows, collaborating globally to turn modeling insights into actionable technology decisions.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Senior Engineer, Unit Process Modeling

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Develop and deploy digital twins and predictive/physics-informed models for semiconductor unit process domains to support fab-technology co-optimization. Build structural and multiphysics models to evaluate process-to-performance interactions and reliability risks, and create composite AI models for yield improvement, reliability assessment, and design-space exploration. Leverage computational methods, machine learning, GenAI/LLM copilots, RAG systems, and agentic AI workflows, collaborating globally to turn modeling insights into actionable technology decisions.
Location: Hyderabad, Telangana, India
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and deploy digital twins and predictive models across process, wafer, die, package, and manufacturing domains to enable technology and fab co-optimization.
  • •Develop structural and multiphysics models to evaluate process-structure-performance interactions, including stress, deformation, cracking, voiding, and reliability risks.
  • •Build physics-informed composite AI models to accelerate technology development, yield improvement, reliability assessment, and design-space exploration.
  • •Apply advanced computational methods and sparse-data modeling with ML to create predictive and prescriptive solutions for complex semiconductor challenges.
  • •Utilize GenAI/LLM copilots, RAG systems, and agentic AI workflows that integrate engineering tools, knowledge bases, simulation environments, and manufacturing data, collaborating globally to translate insights into decisions.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth InsuranceDentalVision

Key Requirements

  • •5+ years of modeling experience in algorithm development, numerical methods, and scientific computing.
  • •Solid modeling experience with semiconductor plasma and etching processes (e.g., Plasma, FPM, HAR, MC modeling).
  • •Experience with wet processes and chemical etching/strip, including material selectivity and chemistry evaluation.
  • •Strong background in thermodynamics, physics, and chemistry, including computational materials science methodologies.
  • •Experience with ML/deep learning concepts and implementation (e.g., regression, neural networks) plus use of modeling software and programming on Linux (Bash, Python, FORTRAN, or C++).
Experience:5+ yearsSemiconductorDRAMNANDAdvanced packagingDigital twinsManufacturingAIComputational materials sciencePhysics-based modeling
Education:PhD / Doctorate in Applied Chemistry, Applied Physics, Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related fields
Skills:DebuggingProblem-solvingWritten communicationVerbal communicationTeam collaboration
Tech Stack:Machine learningDeep learningGenAILarge language modelsLLMsAgentic AIRAG systemsDigital twinsRegressionNeural networksBashPythonFORTRANC++LinuxOpenFOAMANSYS FluentCOMSOLHPEM

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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