Senior Manager, Package PE,  Product and System Engineering (High Bandwidth Memory)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 12+ yearsEducation: mastersSkills: ["Leadership","Problem-solving","Root cause analysis","Communication","Collaboration"]

Lead technical and project execution for high bandwidth memory (HBM) product and system engineering, driving test coverage improvements to reduce time 0 and package failures and improving yield through electrical failure analysis and test optimization. Own root-cause investigation and resolution for quality and RMA packaging issues, while partnering cross-functionally across fab, HBM technology development, design, system development, and quality/reliability. Serve as a domain spokesperson and mentor future technical leaders.

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Micron Technology
Micron Technology
1 month ago

Senior Manager, Package PE,  Product and System Engineering (High Bandwidth Memory)

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Last checked: 20 hours agoStatus: Live

Job Summary

Lead technical and project execution for high bandwidth memory (HBM) product and system engineering, driving test coverage improvements to reduce time 0 and package failures and improving yield through electrical failure analysis and test optimization. Own root-cause investigation and resolution for quality and RMA packaging issues, while partnering cross-functionally across fab, HBM technology development, design, system development, and quality/reliability. Serve as a domain spokesperson and mentor future technical leaders.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Improve assembly-related test coverage to reduce time 0 and package failure DPM and prevent inline fallout in the assembly process.
  • •Drive electrical failure analysis and screens/stress development (DFT) to enhance time 0 coverage and improve HBM yield via test optimization and coverage.
  • •Investigate and resolve quality and RMA packaging issues by identifying root causes using EFA and PFA, and drive improvements with cross-functional teams.
  • •Lead complex, multi-disciplinary projects, making final decisions on risk analysis and project prioritization.
  • •Provide domain expertise and act as organization spokesperson, mentoring and coaching others to develop future technical leaders.

Key Requirements

  • •Bachelors/Masters in Electrical/Electronic/Mechanical Engineering with 12+ years of experience in the semiconductor industry.
  • •Strong leadership skills with proven experience in technical problem-solving using root-cause understanding and in-depth circuit analysis.
  • •Experience in product engineering and packaging (preferred).
  • •Demonstrated leadership in a technical role and the ability to lead teams and technical programs in a dynamic environment.
  • •Strong cross-team collaboration, communication, and presentation skills with a sense of ownership and accountability.
Experience:12+ yearsSemiconductor industryProduct engineeringPackaging
Education:Master's in Electrical/Electronic/Mechanical Engineering
Skills:LeadershipProblem-solvingRoot cause analysisCommunicationCollaboration
Tech Stack:High Bandwidth Memory (HBM)DFTEFAPFADRAMNANDNOR

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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