Intel

1 week ago

Senior Program Managers

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: Just nowStatus: Live

Job Summary

Lead programs for advanced substrate packaging and wafer assembly that enable next-generation AI device architectures. Partner with on-site supplier engineering teams and an internal integration team to qualify new supplier capacity, manage bottleneck processes, and deliver on-time product and test vehicle (TV) schedules. Drive lead-time reduction roadmaps, ensure Process Control System (PCS) commitments, and manage factory startup micro-schedules and ramp-up qualifications, with regular on-site presence and supplier travel.

Location: Tokyo

Workplace: Onsite

Employment Type: Full time

Job Function: Program & Project Management (PMO)

Seniority: Manager level

Key Responsibilities

•Collaborate with on-site supplier engineering teams and the US integration team to advance substrate building block technologies and manage critical process interactions.
•Monitor and improve capacity in bottleneck processes to reduce throughput time (TPT).
•Oversee product and test vehicle (TV) delivery schedules to proactively resolve issues and meet aggressive on-time delivery (OTD) targets.
•Analyze substrate lead times, build reduction roadmaps, and achieve quarterly lead time goals while ensuring supplier adherence to Process Control System (PCS) commitments.
•Design and execute factory TV/product certification plans and qualification activities, including micro-schedules and ramp-up monitoring to ensure smooth, incident-free production ramp-up of new capacity.

Travel: Medium travel

Key Requirements

•Bachelor’s or Master’s degree (or PhD) in Science or Engineering with 8+ (or 4+ for PhD) years of work experience.
•6+ years of experience in fab back-end or substrate manufacturing process development.
•Experience in capacity management and lead time analysis, with track record of yield improvement and structured problem solving.
•Strong understanding of substrate process building blocks including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing.
•Fluent business-level English communication with excellent presentation skills and the ability to influence supplier executive management.

Experience:8+ yearsSemiconductor manufacturingAdvanced packagingSubstrate manufacturing

Education:Bachelor's

Skills:Structured problem solvingSituational leadershipStakeholder managementPresentation abilitiesSupplier influence

Languages:English

Tech Stack:Advanced Packaging Technology DevelopmentAPTDEMIB-THeterogeneous chip architecturesProcess Control System (PCS)Throughput time (TPT)On-time delivery (OTD)Lead time analysisCapacity managementYield improvementComponent embeddingLaser drillingDielectric laminationLithographyMulti-metal electrolytic platingDefect inspection/metrologyElectrical testingTD/rampHVMTV (test vehicle) delivery

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 week ago

Senior Program Managers

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: Just nowStatus: Live

Job Summary

Location: Tokyo

Workplace: Onsite

Employment Type: Full time

Job Function: Program & Project Management (PMO)

Seniority: Manager level

Key Responsibilities

•Collaborate with on-site supplier engineering teams and the US integration team to advance substrate building block technologies and manage critical process interactions.
•Monitor and improve capacity in bottleneck processes to reduce throughput time (TPT).
•Oversee product and test vehicle (TV) delivery schedules to proactively resolve issues and meet aggressive on-time delivery (OTD) targets.
•Analyze substrate lead times, build reduction roadmaps, and achieve quarterly lead time goals while ensuring supplier adherence to Process Control System (PCS) commitments.
•Design and execute factory TV/product certification plans and qualification activities, including micro-schedules and ramp-up monitoring to ensure smooth, incident-free production ramp-up of new capacity.

Travel: Medium travel

Key Requirements

•Bachelor’s or Master’s degree (or PhD) in Science or Engineering with 8+ (or 4+ for PhD) years of work experience.
•6+ years of experience in fab back-end or substrate manufacturing process development.
•Experience in capacity management and lead time analysis, with track record of yield improvement and structured problem solving.
•Strong understanding of substrate process building blocks including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing.
•Fluent business-level English communication with excellent presentation skills and the ability to influence supplier executive management.

Experience:8+ yearsSemiconductor manufacturingAdvanced packagingSubstrate manufacturing

Education:Bachelor's

Skills:Structured problem solvingSituational leadershipStakeholder managementPresentation abilitiesSupplier influence

Languages:English

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor