SR/PRINCIPAL ENGINEER, FE CPIE RAM QUALITY and OPNS ENGINEERING

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Quality & Regulatory (Non-Software)Education: mastersSkills: ["Communication","Collaboration","Stakeholder management","Continuous improvement","Project management"]

Establish strategy, models, and systems to improve RAM defense line hardening, reduce defect variation, and increase operation efficiency across sites. Lead best-known-method (BKM) sharing, abnormal analysis and improvement, and the RAM network alignment through taskforces. Support audits and define metrics for adoption/compliance, benchmark fab performance, and provide tactical coordination on quality, yield maturity, cost, and cycle time. Communicate updates to network leaders and members.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

SR/PRINCIPAL ENGINEER, FE CPIE RAM QUALITY and OPNS ENGINEERING

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Establish strategy, models, and systems to improve RAM defense line hardening, reduce defect variation, and increase operation efficiency across sites. Lead best-known-method (BKM) sharing, abnormal analysis and improvement, and the RAM network alignment through taskforces. Support audits and define metrics for adoption/compliance, benchmark fab performance, and provide tactical coordination on quality, yield maturity, cost, and cycle time. Communicate updates to network leaders and members.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Quality & Regulatory (Non-Software)
Seniority: Mid level

Key Responsibilities

  • •Establish strategy, models, and systems to improve RAM defense line hardening and reduce wafer-at-risk.
  • •Establish strategy and systems to improve RAM quality control and reduce defect OOC% variation.
  • •Improve RAM operation efficiency to increase labor productivity, cycle time performance, and tool utilization while lowering cost.
  • •Develop and share BKM across sites, implement abnormal analysis/improvement, and lead Copy Smart Team (CST) for RAM network alignment on strategy and roadmap.
  • •Support audits with metrics for adoption/compliance, track fab performance metrics for benchmarking, manage projects, and coordinate tactical support for people, safety, yield maturity, quality, cost, and cycle time issues.
Travel: Extensive travel

Key Requirements

  • •Masters/Bachelors in Engineering.
  • •Relevant experience in RDA and/or Metrology.
  • •Proficiency with RAM wafer capacity modeling, wafer-at-risk modeling, FMEA concepts/systems, defect analysis tools, sampling strategy, and Statistical Process Control (SPC) tools.
  • •Experience with cycle time management and related analytics (e.g., Tableau creation and SQL/programming); tableau/SQL knowledge is an advantage.
  • •Willingness to travel internationally, including Extended International Business Travel (EIBT) assignments up to 6 months as needed.
Education:Master's
Skills:CommunicationCollaborationStakeholder managementContinuous improvementProject management
Tech Stack:TableauSQLProgrammingFMEASPCStatistical Process ControlCycle time managementWafer capacity modelingWafer at risk modelingDefect analysis toolsSampling strategyOrganization Change Management

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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