Senior Custom ASIC Engineering Lead

Broadcom
United States
Workplace: OnsiteFull timeUSD 143,800 - 230,000 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 12+ yearsEducation: bachelorsSkills: []

Lead end-to-end customer ASIC programs, from RFQs and design through test, packaging, fabrication, bring-up, and production. Advise customers on EDA flows, design methodologies, and risk mitigation by running Q&A sessions with Broadcom experts. Execute physical design and verify tape-in netlists against stringent tape-out quality standards, while staying current with Broadcom IP and driving technical discussions across teams.

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Broadcom
Broadcom
1 month ago

Senior Custom ASIC Engineering Lead

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Source: Company careers pageValidated by: Fursa AI
Last checked: 27 days agoStatus: Live

Job Summary

Lead end-to-end customer ASIC programs, from RFQs and design through test, packaging, fabrication, bring-up, and production. Advise customers on EDA flows, design methodologies, and risk mitigation by running Q&A sessions with Broadcom experts. Execute physical design and verify tape-in netlists against stringent tape-out quality standards, while staying current with Broadcom IP and driving technical discussions across teams.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

  • •Manage external customer ASIC programs from inception to finish, covering RFQs, collaterals, design, test, packaging, fabrication, bring-up, and production.
  • •Advise customers on best practices in EDA flows and design methodologies through Q&A sessions with Broadcom experts.
  • •Proactively assess design quality and project schedule risks, then coordinate cross-functional teams to execute mitigation actions.
  • •Execute physical design flows to ensure incoming customer tape-in netlists meet stringent tape-out quality standards.
  • •Stay current on Broadcom IPs and technology and actively participate in technical discussions with marketing, sales, legal, and regulatory compliance teams.

Pay and Benefits

Salary: USD 143,800 - 230,000 annually
Perks:Health InsuranceDentalVision401kEquity

Key Requirements

  • •Multiple tape-outs in advanced technology nodes.
  • •Hands-on experience in physical design and STA, including EDA tool flows plus logic simulation, test, and packaging.
  • •Knowledgeable in low power design and power management.
  • •Analyze PPA tradeoffs across library components and architectures.
  • •Programming experience in TCL, shell, and scripting languages.
Experience:12+ yearsSemiconductorASICPhysical designEDALow power design
Education:Bachelor's
Tech Stack:Physical designSTADFTPackagingEDATape-outTape-in netlistsRFQsTCLShell scriptingScripting languagesLogic simulationVerilogDRCLogic synthesisSERDESScanMemory BISTPPABring-up

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn