Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceEducation: bachelorsSkills: ["Problem-solving","Communication","Risk management","Cross-functional collaboration","Continuous improvement"]

Drive intrinsic and extrinsic reliability testing for Micron’s latest HBM products, covering DRAM, Interface die, and stacked products. Develop reliability stress test flows and plans, execute qualification with global quality, and lead DPM reduction across Time 0 and Field metrics. Investigate qual and RMA failures using EFA/PFA, recommend process conversions to improve yields and cost, and collaborate cross-functionally across Fab, TD, GQ, and reliability teams to meet Quality, Cost, and Cycle Time KPIs.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

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Last checked: 6 hours agoStatus: Live

Job Summary

Drive intrinsic and extrinsic reliability testing for Micron’s latest HBM products, covering DRAM, Interface die, and stacked products. Develop reliability stress test flows and plans, execute qualification with global quality, and lead DPM reduction across Time 0 and Field metrics. Investigate qual and RMA failures using EFA/PFA, recommend process conversions to improve yields and cost, and collaborate cross-functionally across Fab, TD, GQ, and reliability teams to meet Quality, Cost, and Cycle Time KPIs.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance

Key Responsibilities

  • •Define and develop reliability stress test flows and test plans covering Product Reliability aspects.
  • •Partner with Global Quality to define qualification plans, review qualification execution progress, and resolve gating issues.
  • •Drive extrinsic reliability (Time 0 and Field DPM) and intrinsic reliability via optimized manufacturing test flows and test strategy to meet Quality, Cost, and Cycle Time KPIs.
  • •Perform root-cause and resolution work for qual and RMA device issues using electric failure analysis (EFA) and physical failure analysis (PFA) in cross-functional collaboration.
  • •Provide recommendations for process conversions to reduce cost and increase yields, and manage risk communications with product leaders on DPM process conversion pace.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
  • •Solid problem-solving skills focused on identifying root causes and exploring solution spaces.
  • •Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • •Exposure to data analysis and statistics using scripting tools such as Python or JMP.
  • •Clear written and spoken communication, especially for articulating technical concepts and findings.
Experience:SemiconductorsDRAMData analysis
Education:Bachelor's in Electrical and Electronics Engineering
Skills:Problem-solvingCommunicationRisk managementCross-functional collaborationContinuous improvement
Tech Stack:PythonJMPCMOSDRAMHBMEFAPFA

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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