Sr. Assembly TD Engineer: Advance PKG stacking

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Manufacturing & Production OperationsExperience: 3+ yearsEducation: mastersSkills: ["Technical problem-solving","Data analysis","Communication","Independent work","Process transfer execution"]

Develop next-generation semiconductor packaging by introducing advanced assembly technologies such as flip chip, TCB, and hybrid bonding. Plan and execute DOE experiments, build and analyze samples, and troubleshoot to improve process efficiency. Drive process transfer from TD to high-volume manufacturing, including stability review using FDC, SPC, and test results. Collaborate across engineering, bumping, PI/NPI, quality, and manufacturing to meet development milestones, using data analytics and automation where applicable.

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Micron Technology
Micron Technology
1 week ago

Sr. Assembly TD Engineer: Advance PKG stacking

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 days agoStatus: Live

Job Summary

Develop next-generation semiconductor packaging by introducing advanced assembly technologies such as flip chip, TCB, and hybrid bonding. Plan and execute DOE experiments, build and analyze samples, and troubleshoot to improve process efficiency. Drive process transfer from TD to high-volume manufacturing, including stability review using FDC, SPC, and test results. Collaborate across engineering, bumping, PI/NPI, quality, and manufacturing to meet development milestones, using data analytics and automation where applicable.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Manufacturing & Production Operations
Seniority: Mid level

Key Responsibilities

  • •Explore and evaluate new semiconductor packaging/assembly technologies such as flip chip, TCB, and hybrid bonding equipment and materials.
  • •Provide plans and resource requirements to enable new technology development.
  • •Set up DOE plans, execute experiments, and build samples with data analysis.
  • •Lead efficiency troubleshooting and improve processes for development and yield.
  • •Prepare documentation and support process transfer from TD to HVM, including reviewing process stability with FDC, SPC, and test results.

Key Requirements

  • •Hands-on experience developing flip chip, TCB, or hybrid bonding processes (wet processing, surface cleaning, plasma surface activation/treatment, or plasma-based dry etching).
  • •3+ years of assembly process experience.
  • •Strong technical problem-solving and data analysis skills.
  • •Open mindset to introduce new technology and drive process development.
  • •Master’s degree in engineering (materials science, mechanical, chemical engineering, or physics/chemistry).
Experience:3+ yearsSemiconductorAdvanced packaging
Education:Master's in material science, mechanical, chemical engineering or physics and chemistry
Skills:Technical problem-solvingData analysisCommunicationIndependent workProcess transfer execution
Languages:English
Tech Stack:DOEFDCSPCTest resultsFlip chipTCBHybrid bondingWet processingSurface cleaningPlasma surface activationPlasma-based dry etchingData analyticsAutomation toolsAI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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