Package Thermal Technologist

AMD
Austin
Workplace: OnsiteFull timeFunction: OtherEducation: phdSkills: ["Communication","Team collaboration","Problem-solving"]

PCB-centric Mechanical Modeling Architect responsible for defining next-generation packaging-platform architectures using model-based decisions and System-Technology Co-Optimization (STCO). Develop and apply mechanical/multi-physics models to guide package/board-level architecture, material choices, and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions for data center and high-performance computing systems.

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FursaFursa
AMD
AMD
6 months ago

Package Thermal Technologist

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Source: Company careers pageValidated by: Fursa AI
Last checked: 12 hours agoStatus: Live

Job Summary

PCB-centric Mechanical Modeling Architect responsible for defining next-generation packaging-platform architectures using model-based decisions and System-Technology Co-Optimization (STCO). Develop and apply mechanical/multi-physics models to guide package/board-level architecture, material choices, and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions for data center and high-performance computing systems.
Location: Austin
Workplace: Onsite
Employment Type: Full time

Key Responsibilities

  • •Define targets and strategic direction for mechanical and PCB technology development, assess technology readiness, and influence product roadmaps.
  • •Drive model-based architecture and design decisions for development and qualification of advanced PCB technologies, including materials, stack-ups, high-layer-count designs, stiffness control and SMT & manufacturability considerations.
  • •Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) and drive validation strategies with internal/external labs to enable STCO across silicon, package, board and platform.
  • •Engage with PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
  • •Serve as mechanical & multi-physics subject-matter expert for PCB and board-level architectures with a primary focus on data center platforms.

Key Requirements

  • •MS or PhD in relevant Engineering disciplines or physics
  • •Strong background in mechanical/ multi-physics modeling (structural, thermo-mechanical, electro-thermal, electro-optical)
  • •Experience with advanced PCB technologies, materials, high-layer-count designs, warpage control, assembly constraints
  • •Experience owning model-based architecture and design decisions for PCB/board-level systems
  • •Ability to collaborate across silicon, package, board, thermal, optical, mechanical, manufacturing and system architecture teams
Experience:SemiconductorsPCBPackagingMechanical modeling
Education:PhD / Doctorate
Skills:CommunicationTeam collaborationProblem-solving
Languages:English
Tech Stack:FEAMulti-physicsMechanical modelingStructural analysisElectro-thermalElectro-opticalSMTSolder joint reliabilityPackaging design

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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