Hardware - Thermal Engineer

FuriosaAI
Seoul
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringSkills: ["Collaboration","Positive attitude","Proactive mindset"]

Own end-to-end thermal design for NPU/ASIC packages through PCB, cards, and server chassis—selecting and engineering heatsinks, heat pipes, vapor chambers, cold plates, and thermal interface materials. Use CFD and EM-thermal co-simulation (FloTHERM, Icepak; HFSS/SIwave/PowerDC) and validate with wind tunnel testing and temperature measurements. Partner with electrical, mechanical, and manufacturing teams to integrate and verify thermal specifications across packaged hardware.

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FursaFursa
FuriosaAI
FuriosaAI
2 weeks ago

Hardware - Thermal Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 58 minutes agoStatus: Live

Job Summary

Own end-to-end thermal design for NPU/ASIC packages through PCB, cards, and server chassis—selecting and engineering heatsinks, heat pipes, vapor chambers, cold plates, and thermal interface materials. Use CFD and EM-thermal co-simulation (FloTHERM, Icepak; HFSS/SIwave/PowerDC) and validate with wind tunnel testing and temperature measurements. Partner with electrical, mechanical, and manufacturing teams to integrate and verify thermal specifications across packaged hardware.
Location: Seoul
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

  • •Define end-to-end thermal design across NPU/ASIC package, PCB, card, and system levels.
  • •Select and design cooling components (heatsinks, heat pipes, vapor chambers, cold plates, and TIM).
  • •Run CFD and EM-thermal co-simulations and analyze trade-offs across air, liquid, 2-phase, and immersion cooling.
  • •Validate thermal performance via wind tunnel testing and hands-on temperature measurements, including DOE-based correlation.
  • •Support reliability testing (thermal cycling, burn-in) and integrate thermal specs with electrical, mechanical, and manufacturing teams, including OEM/ODM and hyperscale customers.

Key Requirements

  • •Use CFD to model heat transfer and fluid flow for thermal design.
  • •Design active and passive cooling solutions, including heatsinks, fans, and liquid cooling cold plates.
  • •Evaluate NPU card thermal performance using temperature measurement tools (e.g., multi temp recorder, FLIR cameras, thermocouples).
  • •Collaborate with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware.
  • •Preferred: experience with GPU/NPU card development or datacenter server development and familiarity with FloTHERM/Icepak; business-level English.
Experience:DatacenterGPUNPU
Skills:CollaborationPositive attitudeProactive mindset
Languages:English
Tech Stack:CFDFloTHERMIcepakHFSSSIwavePowerDCEM-thermal co-simulationWind tunnel testingThermocouplesIR camerasRTDsFLIRMulti temp recorderHeatsinksHeat pipesVapor chambersCold platesTIMOCP OAMPCIe CEM

Company Brief

FuriosaAI
Designs and develops data‑center AI inference accelerators (RNGD) and a full stack hardware‑software platform to deliver energy‑efficient, high‑performance AI compute for enterprise and cloud customers.
Industry: Hardware Devices
Company Size: Medium (51 to 250 employees)
Growth: Scaleup
Valuation: USD 500M to 1B
Funding: Series C
Headquarters: Seoul, South Korea
Founded: 2017
Glassdoor
Glassdoor: 4.6
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