Principal Product Engineer

Cadence Design Systems
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 7+ yearsEducation: bachelorsSkills: ["Troubleshooting","Technical documentation","Communication","Teamwork","Customer-oriented","Proactive","Self-motivated","Coordination"]

Develop and integrate EDA tools and engines into the consolidated 3D-IC platform, working with R&D teams to plan, implement, and verify 3D-IC system flows. Provide technical support and guidance to field teams, and coordinate across multiple R&D and field groups to deliver EDA solutions to customers. Use place-and-route and signoff tooling expertise, including Cadence digital flows and Allegro Package Designer, and support customer engagements through documentation and troubleshooting.

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FursaFursa
Cadence Design Systems
Cadence Design Systems
6 days ago

Principal Product Engineer

✓ Verified Job

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live
Reposted: similar role first listed 4 months ago

Job Summary

Develop and integrate EDA tools and engines into the consolidated 3D-IC platform, working with R&D teams to plan, implement, and verify 3D-IC system flows. Provide technical support and guidance to field teams, and coordinate across multiple R&D and field groups to deliver EDA solutions to customers. Use place-and-route and signoff tooling expertise, including Cadence digital flows and Allegro Package Designer, and support customer engagements through documentation and troubleshooting.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and integrate various EDA tools and engines into the consolidated 3D-IC platform.
  • •Partner with R&D to develop, integrate, and enhance 3D-IC system planning, implementation, and analysis/verification.
  • •Collaborate with field teams for customer engagement and provide technical support and guidance.
  • •Communicate and coordinate with multiple R&D groups and field teams to enable EDA solutions to customers.
  • •Support 3D-IC system planning, implementation, and signoff flows (including analysis/verification).

Key Requirements

  • •BS degree with 7+ years or MS degree with 5+ years of engineering work experience in the semiconductor industry.
  • •Experience with physical implementation, place-and-route, and signoff tools, including Cadence digital flows.
  • •Experience with advanced packaging design with Allegro Package Designer.
  • •Hands-on scripting experience (TCL, Perl, YAML, and Python).
  • •Strong troubleshooting and technical documentation skills with a customer-oriented, proactive team attitude.
Experience:7+ yearsSemiconductorEDA3D-IC
Education:Bachelor's
Skills:TroubleshootingTechnical documentationCommunicationTeamworkCustomer-orientedProactiveSelf-motivatedCoordination
Tech Stack:EDA3D-ICCadence digital flowsAllegro Package DesignerPlace-and-routeSignoffTCLPerlYAMLPython

Company Brief

Cadence Design Systems
Provides electronic design automation (EDA) software, IP, and services for semiconductor and systems companies to design, verify, and implement integrated circuits, systems-on-chip, and electronic systems across industries including communications, automotive, and consumer electronics.
Industry: Developer Tools
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1988
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