Principal Physical Design Architect, HBM

Micron Technology
United States
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Analytical thinking","Problem-solving","Collaboration","Technical communication"]

As an HBM Design Architect, you will drive physical design and layout for next-generation High Bandwidth Memory (HBM) products, covering optimized floorplans, circuit placement and routing, and high-quality block-level layouts on advanced process nodes. You’ll collaborate across architecture, circuit build, and layout teams to evaluate timing/area/power trade-offs, align with manufacturability and physical verification constraints, and support reviews and issue-fixing across physical build and full-chip integration for DRAM solutions.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
2 months ago

Principal Physical Design Architect, HBM

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live

Job Summary

As an HBM Design Architect, you will drive physical design and layout for next-generation High Bandwidth Memory (HBM) products, covering optimized floorplans, circuit placement and routing, and high-quality block-level layouts on advanced process nodes. You’ll collaborate across architecture, circuit build, and layout teams to evaluate timing/area/power trade-offs, align with manufacturability and physical verification constraints, and support reviews and issue-fixing across physical build and full-chip integration for DRAM solutions.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop floorplans that optimize circuit placement, routing efficiency, and power delivery networks.
  • •Deliver block-level analog or mixed-signal layouts using advanced foundry process technologies.
  • •Collaborate with HBM architects and circuit designers on floorplanning, placement, routing, and integration strategies.
  • •Evaluate timing, area, power, and complexity trade-offs for high-speed DRAM and mixed-signal circuits.
  • •Participate in reviews and help fix issues across physical build, parasitic extraction, and full-chip integration.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysParental LeaveIncome Protection

Key Requirements

  • •MS with 5+ years of memory-related layout/physical design experience, or BS with 7+ years of relevant experience.
  • •Experience with Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
  • •Strong analog layout fundamentals (e.g., matching, EM, latch-up, coupling, IR-drop, crosstalk, and parasitics).
  • •Hands-on development of analog and mixed-signal layouts such as sense amplifiers, LDOs, and PLLs.
  • •Ability to evaluate timing, area, power, and complexity trade-offs and support physical verification constraints.
Experience:5+ yearsMemoryDRAMMixed-signalHBM
Education:Master's
Skills:Analytical thinkingProblem-solvingCollaborationTechnical communication
Tech Stack:Cadence VLECadence VXLMentor Graphics CalibreDRCLVSParasitic extraction

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn