Principal Collateral Device Engineer

Create next-generation device and interconnect technology within Intel Foundry’s MDCE organization by ensuring process device performance using deep device physics expertise. Lead cross-functional teams to define derivative architectures (design rules, transistors, interconnects), develop scribe-line and process monitoring structures, and optimize device collateral using test chip data, DOE, and statistical methods. Partner with Process Integration, Yield, Device, and Design to bridge DTCO skills and deliver collateral solutions in a fast-paced manufacturing environment.