Broadcom

1 week ago

ASIC Package Design Manager

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Lead an engineering team to design complex flip-chip-BGA ASIC packages for high-speed SerDes and very-high-power-delivery applications. Own project management for 20+ concurrent package designs, develop technical methodologies and package design rules, and coordinate customer, vendor, and cross-functional collaboration across a worldwide R&D organization. Contribute to technical efforts spanning SI/PI, simulations and extractions, DFx tradeoffs, and mechanical/thermal modeling for AI, networking, HPC, and 5G base station workloads.

Location: San Jose

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Manager level

Key Responsibilities

•Lead and support a team of engineers designing complex flip-chip-BGA packages for high-speed SerDes and very-high-power-delivery ASICs.
•Create and track project plans for 20+ concurrent package designs, managing scope, schedules, and resources.
•Organize team and customer activities to keep projects on track, and communicate status, next steps, and risks.
•Develop technical methodologies and steering package technology and design rules with team input.
•Collaborate with customers, vendors, and cross-functional partners on package design execution and requirements.

Travel: Low travel

Pay and Benefits

Salary: USD 143,800 - 230,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityEmployee AssistancePaid HolidaysPaid Leave

Key Requirements

•Preferred experience managing people and projects.
•BSEE/MSEE (or similar) plus 12+ years of flip-chip-BGA package design experience, including high-speed SerDes, with at least 3 years in management.
•Knowledge of package-level signal integrity and power integrity to apply to package designs.
•Experience collaborating with a worldwide team across multiple time zones, including co-design with internal and vendor designers.
•Technical understanding of the package-design lifecycle, design data (e.g., .mcm, package spreadsheet, drawings), DFx tradeoffs, layout, SI/PI extractions and simulations, and automation code development.

Experience:12+ years

Education:Bachelor's in Electrical Engineering

Skills:Self-managementOrganizationCommunicationCross-functional collaborationTeam leadership

Tech Stack:Flip-chip-BGAASIC packagingSerDes448G5G RFMicrowave ADCMicrowave DACHBMDDR5SI/PISignal integrityPower integritySI/PI extractionsSimulationsDFxManufacturabilityReliabilityAssurance of supplyLayoutAutomation code development

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

1 week ago

ASIC Package Design Manager

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Location: San Jose

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Manager level

Key Responsibilities

•Lead and support a team of engineers designing complex flip-chip-BGA packages for high-speed SerDes and very-high-power-delivery ASICs.
•Create and track project plans for 20+ concurrent package designs, managing scope, schedules, and resources.
•Organize team and customer activities to keep projects on track, and communicate status, next steps, and risks.
•Develop technical methodologies and steering package technology and design rules with team input.
•Collaborate with customers, vendors, and cross-functional partners on package design execution and requirements.

Travel: Low travel

Pay and Benefits

Salary: USD 143,800 - 230,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityEmployee AssistancePaid HolidaysPaid Leave

Key Requirements

•Preferred experience managing people and projects.
•BSEE/MSEE (or similar) plus 12+ years of flip-chip-BGA package design experience, including high-speed SerDes, with at least 3 years in management.
•Knowledge of package-level signal integrity and power integrity to apply to package designs.
•Experience collaborating with a worldwide team across multiple time zones, including co-design with internal and vendor designers.
•Technical understanding of the package-design lifecycle, design data (e.g., .mcm, package spreadsheet, drawings), DFx tradeoffs, layout, SI/PI extractions and simulations, and automation code development.

Experience:12+ years

Education:Bachelor's in Electrical Engineering

Skills:Self-managementOrganizationCommunicationCross-functional collaborationTeam leadership

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn