New College Grad - Product Yield Enhancement Engineer, HBM

Micron Technology
Boise, Idaho
Workplace: OnsiteFull timeFunction: Communications, PR & Community0Education: bachelorsSkills: ["Collaboration","Analysis","Root-cause investigation","Technical reporting","Fault isolation"]

Join the team bringing next-generation High Bandwidth Memory (HBM) products from design to high-volume manufacturing. As a yield enhancement engineer, you’ll perform electrical and physical failure analysis on production test, qualification, and customer return (RMA) data to isolate root causes tied to fabrication or assembly processes. You’ll generate clear failure reports, collaborate across Product, Process, Assembly, Quality, and management, and use AI-assisted tools to accelerate pattern detection and corrective actions.

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Micron Technology
Micron Technology
2 weeks ago

New College Grad - Product Yield Enhancement Engineer, HBM

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 14 hours agoStatus: Live

Job Summary

Join the team bringing next-generation High Bandwidth Memory (HBM) products from design to high-volume manufacturing. As a yield enhancement engineer, you’ll perform electrical and physical failure analysis on production test, qualification, and customer return (RMA) data to isolate root causes tied to fabrication or assembly processes. You’ll generate clear failure reports, collaborate across Product, Process, Assembly, Quality, and management, and use AI-assisted tools to accelerate pattern detection and corrective actions.
Location: Boise, Idaho
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Perform electrical failure analysis and fault isolation using emission microscopy, laser-based methods, and EOTPR.
  • •Analyze and model failure signatures from backend testing, qualification, and RMA data to identify root causes.
  • •Apply physical failure analysis and de-processing techniques to isolate defects.
  • •Develop technical knowledge of CMOS/FinFET fabrication processes, device structures, and process integration.
  • •Generate failure analysis reports and collaborate cross-functionally to drive resolution; support swing or night shifts as needed.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Leave

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Computer Engineering, Physics, Chemistry, or equivalent practical experience.
  • •0-2 years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis.
  • •Experience with computer-aided design (CAD), including layout and schematic analysis.
  • •Strong understanding of semiconductor device physics and VLSI design principles.
  • •Proficiency in scripting within UNIX/Linux environments (e.g., Tcl, Bash, Shell).
Experience:0SemiconductorYield engineeringFault isolationFailure analysis
Education:Bachelor's
Skills:CollaborationAnalysisRoot-cause investigationTechnical reportingFault isolation
Tech Stack:HBMHigh Bandwidth MemoryCADUNIXLinuxTclBashShellEmission microscopyEOTPRLaser-based methodsAI-assisted tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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