Module Development Engineer

Intel
Oregon
Workplace: OnsiteFull timeUSD 99,030 - 162,500 annuallyFunction: Product ManagementExperience: 4+ yearsEducation: bachelorsSkills: ["Engineering judgment","Problem-solving","Stakeholder management","Technical and analytical skills"]

Own thermal, mechanical, and electrical design, analysis, and development for semiconductor packaging media. Define package performance specifications and support technology certification through qualification plans and data collection. Perform tests and research on materials, set material specifications for contract assemblers and raw material vendors, and partner with QA and Purchasing on quality and vendor performance. Provide packaging process improvement guidance and respond to customer requests as they arise, using engineering judgment to solve problems.

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Intel
Intel
1 day ago

Module Development Engineer

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Last checked: 6 hours agoStatus: Live

Job Summary

Own thermal, mechanical, and electrical design, analysis, and development for semiconductor packaging media. Define package performance specifications and support technology certification through qualification plans and data collection. Perform tests and research on materials, set material specifications for contract assemblers and raw material vendors, and partner with QA and Purchasing on quality and vendor performance. Provide packaging process improvement guidance and respond to customer requests as they arise, using engineering judgment to solve problems.
Location: Oregon
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Responsible for thermal, mechanical, and electrical design, analysis, and development of media for semiconductor packaging.
  • •Define overall package performance and specifications, and realize technology certification through qualification plans and data collection.
  • •Conduct tests and research on basic materials and properties.
  • •Establish material specifications for contract assemblers and raw material vendors; coordinate with Quality Assurance and Purchasing on material quality and vendor performance.
  • •Consult on packaging problems and process improvements; respond to customer/client requests as they occur.

Pay and Benefits

Salary: USD 99,030 - 162,500 annually
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •Bachelor’s degree in mechanical engineering or related STEM with 4+ years of experience, or a Master’s degree with 2+ years.
  • •Hands-on experience with mechanical design and CAD tools including Solidworks, Driveworks, and RSS analysis.
  • •Experience with geometric dimensioning and tolerancing and finite element analysis (FEA).
  • •Full-cycle project management experience.
  • •Preferred: 3+ years in material handling systems such as pick-n-place, motion control, and vision systems.
Experience:4+ yearsSemiconductorsSemiconductor packagingManufacturingMaterials
Education:Bachelor's in Mechanical engineering
Skills:Engineering judgmentProblem-solvingStakeholder managementTechnical and analytical skills
Tech Stack:CADSolidworksDriveworksRSS analysisGeometric DimensioningFinite Element AnalysisPick-n-placeMotion controlVision systemsStatistical design of experimentsDOESolidWorks

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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