SR ENGINEER, APTD Wafer Thinning / CMP process

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 4+ yearsEducation: mastersSkills: ["Independent thinking","Teamwork","Technical communication","Problem-solving","Root cause analysis"]

Drive improvements in wafer thinning and CMP process performance by coordinating experiments for technology development and yield improvement. Support advanced packaging R&D and troubleshoot complex process issues using root-cause analysis. Collaborate with cross-team partners to perform mechanical characterization and testing globally, review and present data, and generate technical documentation for internal and external reporting. Serve as an on-site technical consultant to guide project execution and decisions.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

SR ENGINEER, APTD Wafer Thinning / CMP process

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Drive improvements in wafer thinning and CMP process performance by coordinating experiments for technology development and yield improvement. Support advanced packaging R&D and troubleshoot complex process issues using root-cause analysis. Collaborate with cross-team partners to perform mechanical characterization and testing globally, review and present data, and generate technical documentation for internal and external reporting. Serve as an on-site technical consultant to guide project execution and decisions.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Drive improvements in wafer thinning/CMP process performance and support yield improvement experiments.
  • •Coordinate experiments for technology development and resolve process engineering issues via root-cause analysis.
  • •Assist advanced package technology (chip stacking, 2.5D/3D) research and development.
  • •Support on-site project execution, providing technical consultation and making technical decisions.
  • •Generate internal/external documentation, review and present data, and lead discussions with packaging material suppliers.

Key Requirements

  • •At least 4 years of experience in the semiconductor-related industry.
  • •Master’s degree or higher (PhD plus) in Chemistry, Physics, Materials, or related engineering science fields.
  • •Experience with Si grinding and/or Si CMP, Cu CMP, and/or Oxide CMP technologies.
  • •Strong independent thinking and innovation.
  • •Fluent communication in both English and Chinese.
Experience:4+ yearsSemiconductor
Education:Master's in Chemistry, Physic, Material, engineering science related fields
Skills:Independent thinkingTeamworkTechnical communicationProblem-solvingRoot cause analysis
Languages:EnglishChinese
Tech Stack:Wafer thinningCMPSi grindingSi CMPCu CMPOxide CMPMaterials characterizationMechanical characterizationYield improvementAdvanced packagingChip stacking2.5D3D

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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