Intel

3 days ago

Substrate Supplier Enablement Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 5 hours agoStatus: Live

Job Summary

Lead substrate supplier development and qualification for advanced packaging technologies, enabling new manufacturing capacity across advanced packaging suppliers. Drive technical enablement and readiness milestones for technologies such as high density FCBGA, EMIB-T, and glass core substrates. Collaborate with cross-functional engineering teams and supplier partners to define building block processes, ensure Product Control System (PCS) commitments, and design validation and certification plans to improve yield.

Location: Seoul

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Collaborate with suppliers and internal engineering teams to develop building block processes across substrate technologies including embedding, core fabrication, laser drilling, lamination, lithography, plating, inspection/metrology, and electrical testing.
•Partner with on-site supplier engineering teams and the APTD Substrate Integration team to advance building block technologies and manage critical process interactions.
•Ensure suppliers meet Product Control System (PCS) commitments with rigor and consistency.
•Design and implement factory technology validation and product certification plans with cross-functional teams, focused on yield improvement.
•Develop and maintain micro schedules for factory startup milestones and lead qualification/ramp activities to enable incident-free production ramp and new capacity introduction.

Travel: Low travel

Key Requirements

•Bachelor’s with 6+ years, or Master’s with 4+ years, or PhD with 2+ years in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
•Use statistical tools and methods, including Statistical Process Control (SPC), for yield improvement.
•Experience managing complex projects and delivering results in high-volume manufacturing environments.
•Strong foundation in advanced packaging, substrates, or semiconductor manufacturing with experience in supplier management or technology enablement.
•Experience with process flow development, FMEA, DOE design, and problem-solving tools.

Experience:6+ yearsAdvanced packagingSemiconductor manufacturingHigh-volume manufacturing

Education:Bachelor's

Tech Stack:Statistical Process Control (SPC)FCBGAEMIB-TGlass core substrateComponent embeddingCore fabricationLaser drillingDielectric laminationLithographyElectrolytic multi metal platingDefect inspection/metrologyElectrical testingProduct Control System (PCS)Yield improvementFMEADOE

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

3 days ago

Substrate Supplier Enablement Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 5 hours agoStatus: Live

Job Summary

Location: Seoul

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Collaborate with suppliers and internal engineering teams to develop building block processes across substrate technologies including embedding, core fabrication, laser drilling, lamination, lithography, plating, inspection/metrology, and electrical testing.
•Partner with on-site supplier engineering teams and the APTD Substrate Integration team to advance building block technologies and manage critical process interactions.
•Ensure suppliers meet Product Control System (PCS) commitments with rigor and consistency.
•Design and implement factory technology validation and product certification plans with cross-functional teams, focused on yield improvement.
•Develop and maintain micro schedules for factory startup milestones and lead qualification/ramp activities to enable incident-free production ramp and new capacity introduction.

Travel: Low travel

Key Requirements

•Bachelor’s with 6+ years, or Master’s with 4+ years, or PhD with 2+ years in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
•Use statistical tools and methods, including Statistical Process Control (SPC), for yield improvement.
•Experience managing complex projects and delivering results in high-volume manufacturing environments.
•Strong foundation in advanced packaging, substrates, or semiconductor manufacturing with experience in supplier management or technology enablement.
•Experience with process flow development, FMEA, DOE design, and problem-solving tools.

Experience:6+ yearsAdvanced packagingSemiconductor manufacturingHigh-volume manufacturing

Education:Bachelor's

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor