Die Sort Module Engineer (Contract)

Intel
Malaysia
Workplace: OnsiteContractFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Communication","Collaboration","Problem-solving","Data-driven decision-making"]

Improve process and equipment performance for SDx Module within Intel’s Wafer Packaging Manufacturing organization. Lead continuous improvement for test equipment and module performance across NPI/NTI and high-volume manufacturing, partnering with technology development and factories to define critical process parameters. Troubleshoot escalations, conduct data analysis, and qualify tools to ensure production-ready operation. Guide a small team supporting critical factory projects, installations, and ramp roadmap alignment.

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FursaFursa
Intel
Intel
1 day ago

Die Sort Module Engineer (Contract)

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Job Summary

Improve process and equipment performance for SDx Module within Intel’s Wafer Packaging Manufacturing organization. Lead continuous improvement for test equipment and module performance across NPI/NTI and high-volume manufacturing, partnering with technology development and factories to define critical process parameters. Troubleshoot escalations, conduct data analysis, and qualify tools to ensure production-ready operation. Guide a small team supporting critical factory projects, installations, and ramp roadmap alignment.
Location: Malaysia
Workplace: Onsite
Employment Type: Contract
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Lead continuous improvement for test equipment and module performance for NPI/NTI to meet safety, quality, productivity, and cost targets in HVM.
  • •Collaborate with technology development and partner factories to define critical process parameters for successful product ramps.
  • •Proactively manage capacity by aligning with the product roadmap, ordering collaterals, and qualifying tools.
  • •Provide hands-on troubleshooting for process and equipment escalations from supervisors, shift MTs, or ES, analyzing detailed data to resolve complex issues.
  • •Support critical factory projects, including tool/equipment installations, and guide a small team with a collaborative approach.

Key Requirements

  • •Bachelor/Master Degree in Electrical/Electronics/Mechanical/Mechatronics and Materials Engineering.
  • •Experience in semiconductor back-end assembly, including tool and equipment qualification for test and metrology NPI/NTI deployments.
  • •Basic understanding of Statistical Process Control (SPC) and statistical data analysis, with structured problem-solving experience.
  • •Expertise (or strong added advantage) in Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and Root Cause Analysis (RCA).
  • •Strong communication skills to collaborate cross-functionally and present technical data clearly.
Experience:Semiconductor back-end assemblySemiconductor packagingHigh-volume manufacturingNPI/NTI
Education:Bachelor's
Skills:CommunicationCollaborationProblem-solvingData-driven decision-making
Tech Stack:ScriptingStatistical toolsSPCDOEFMEARCAData analysisDie/wafer sortTest programming

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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