Career Accelerator Program - Packaging Engineer

Texas Instruments
Dallas
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Analytical and problem solving","Written communication","Verbal communication","Team collaboration","Time management","Relationship building","Initiative","Fast-paced adaptability"]

Join a 12-month Career Accelerator Program focused on semiconductor packaging technologies. You’ll partner across teams to design and develop advanced packages (e.g., Wirebond, Flip Chip, Modules, SIPs), support qualification and production reliability/yield requirements, run design-of-experiments with material suppliers, and use electrical/mechanical/thermal models to establish design rules and reduce high-risk designs.

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FursaFursa
Texas Instruments
Texas Instruments
1 day ago

Career Accelerator Program - Packaging Engineer

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Last checked: 3 hours agoStatus: Live

Job Summary

Join a 12-month Career Accelerator Program focused on semiconductor packaging technologies. You’ll partner across teams to design and develop advanced packages (e.g., Wirebond, Flip Chip, Modules, SIPs), support qualification and production reliability/yield requirements, run design-of-experiments with material suppliers, and use electrical/mechanical/thermal models to establish design rules and reduce high-risk designs.
Location: Dallas
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Graduate level

Key Responsibilities

  • •Partner with businesses to design and develop internal and external solutions for semiconductor packaging technologies (Wirebond, Flip Chip, Modules, SIPs and advanced packages)
  • •Participate in cross-functional teams to support product qualification and production and help meet reliability and yield requirements, design testability, and test coverage
  • •Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance reliability and performance
  • •Conduct electrical, mechanical, and thermal models to understand silicon-to-package interaction and establish design rules to predict and prevent high-risk designs
  • •Interface across work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies

Key Requirements

  • •Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related fields
  • •Cumulative 3.0/4.0 GPA or higher
  • •Basic understanding of statistical process control (SPC)
  • •Semiconductor packaging knowledge (manufacturing processes, assembly, reliability, materials, characterization, FA)
  • •Demonstrated analytical/problem-solving skills with strong written and verbal communication, and ability to collaborate in fast-paced environments
Education:Bachelor's in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related
Skills:Analytical and problem solvingWritten communicationVerbal communicationTeam collaborationTime managementRelationship buildingInitiativeFast-paced adaptability

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn