Engineer, Process Integration PDE (Package Development Engineering)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & Community0Education: bachelorsSkills: ["Analytical thinking","Logical thinking","Critical thinking","Cross-functional collaboration","Communication"]

Drive process integration excellence for High Bandwidth (HBM) products during New Product Introduction (NPI), ensuring process readiness, yield ramp, and cross-module integration across post-wafer finishing, assembly, and test. Partner with Fab, Assembly, Test, Yield, and Quality to identify risks early, resolve integration issues, execute characterization and Design of Experiments (DOEs), perform yield/defect analysis, and support NPI-to-HVM handoff. Integrate AI-assisted tools into daily work to improve efficiency and quality.

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FursaFursa
Micron Technology
Micron Technology
4 days ago

Engineer, Process Integration PDE (Package Development Engineering)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live
Reposted: similar role first listed 6 months ago

Job Summary

Drive process integration excellence for High Bandwidth (HBM) products during New Product Introduction (NPI), ensuring process readiness, yield ramp, and cross-module integration across post-wafer finishing, assembly, and test. Partner with Fab, Assembly, Test, Yield, and Quality to identify risks early, resolve integration issues, execute characterization and Design of Experiments (DOEs), perform yield/defect analysis, and support NPI-to-HVM handoff. Integrate AI-assisted tools into daily work to improve efficiency and quality.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and effectiveness within organizational standards and legal requirements.
  • •Execute assigned HBM NPI process integration (PI) tasks following defined procedures and phase-gate requirements, including lot tracking and readiness activities.
  • •Support NPI-to-high volume manufacturing (HVM) handoff activities and associated documentation.
  • •Perform process characterization, Design of Experiments (DOEs), and window studies; conduct yield, defect, and variability analysis; support RCA and corrective actions for scoped issues.
  • •Collaborate with Fab, Assembly, Test, Yield, and Quality teams; communicate status, risks, and issues; prepare technical documentation, trackers, and summaries for NPI/model-of-record and program reviews.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth Insurance

Key Requirements

  • •Bachelor’s or master’s degree in engineering or a related discipline.
  • •0–2 years of relevant experience in semiconductor manufacturing, process, or product engineering.
  • •Basic understanding of semiconductor process flows and process integration concepts.
  • •Familiarity with data analysis and basic statistics (Excel; JMP/Python preferred).
  • •Ability to follow defined NPI procedures and phase-gate requirements.
Experience:0Semiconductor manufacturing
Education:Bachelor's in engineering or related discipline
Skills:Analytical thinkingLogical thinkingCritical thinkingCross-functional collaborationCommunication
Tech Stack:AIExcelJMPPythonHBMNPIDOEsPhase-gate requirements

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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