Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 2+ yearsEducation: phdSkills: ["Collaboration","Problem-solving","Data analysis","Tenacity"]

Develop and improve wafer-level semiconductor post-fab finishing processes for high-performance memory, focusing on performance, cost, manufacturability, quality, reliability, and schedule. Establish wafer thinning and backside metal interconnect process conditions, evaluate equipment/materials, and drive quality improvements via correlations, inspection/testing, and advanced controls. Partner across packaging and engineering teams to integrate and transition technologies from development through high-volume manufacturing, including POR/MOR documentation.

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FursaFursa
Micron Technology
Micron Technology
4 weeks ago

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

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Last checked: 6 hours agoStatus: Live

Job Summary

Develop and improve wafer-level semiconductor post-fab finishing processes for high-performance memory, focusing on performance, cost, manufacturability, quality, reliability, and schedule. Establish wafer thinning and backside metal interconnect process conditions, evaluate equipment/materials, and drive quality improvements via correlations, inspection/testing, and advanced controls. Partner across packaging and engineering teams to integrate and transition technologies from development through high-volume manufacturing, including POR/MOR documentation.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and enable wafer-level post-fab finishing processes, including wafer thinning and backside metal interconnect, to meet performance, cost, manufacturability, quality, reliability, and schedule requirements.
  • •Upgrade process capabilities and deliver technology node requirements and scaling for the next node through process management projects.
  • •Evaluate and promote new equipment and materials, set process parameters for semiconductor equipment, and plan for new equipment/materials.
  • •Drive quality improvement by ensuring defense coverage through process, measurement, inspection, and testing; identify improvement opportunities via correlations and continuous data analysis.
  • •Coordinate with internal and external partners to build and execute technology development strategies, integrate manufacturing processes, and ensure smooth transitions to high-volume production using POR/MOR documentation.

Key Requirements

  • •B.S./M.S./Ph.D. (or equivalent) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or a related technical field.
  • •2+ years of semiconductor process development, preferably in wafer bonding, plating, warpage control, and packaging.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • •Experience with Visual Basic for automation and tool integration.
  • •Knowledge of E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control; strong data analytics to support SPC, DOE, defect analysis, and dashboarding.
Experience:2+ yearsSemiconductorsAdvanced packagingAI-enabled manufacturing
Education:PhD / Doctorate
Skills:CollaborationProblem-solvingData analysisTenacity
Tech Stack:PythonRSQLVisual BasicE3FDCRMSSPCDOEAutoCAD3D PrintingDashboarding

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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