Staff/Principal Engineer - CMP Advanced NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5-12 yearsSkills: ["Communication","Collaboration","Mentorship","Self-driven","Project management"]

Drive CMP process development for advanced 3D NAND in Micron’s Singapore dry etch R&D team. Develop and optimize chemical mechanical planarization procedures to improve next-generation memory quality and reliability, widen process margins, and evaluate manufacturability for N+, N++ and future nodes. Lead experiments, monitor and control processes using metrology, collaborate with internal teams and vendors, and contribute technical guidance through roadmap planning, complex projects, and knowledge transfer.

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Micron Technology
Micron Technology
7 months ago

Staff/Principal Engineer - CMP Advanced NAND

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Job Summary

Drive CMP process development for advanced 3D NAND in Micron’s Singapore dry etch R&D team. Develop and optimize chemical mechanical planarization procedures to improve next-generation memory quality and reliability, widen process margins, and evaluate manufacturability for N+, N++ and future nodes. Lead experiments, monitor and control processes using metrology, collaborate with internal teams and vendors, and contribute technical guidance through roadmap planning, complex projects, and knowledge transfer.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize CMP procedures to improve quality and reliability for next-generation Micron memory parts.
  • •Conduct fundamental research, consumables development, and hardware evaluation; test novel CMP processes for advanced NAND applications.
  • •Initiate and manage experiments to widen process margins and evaluate manufacturability of next-node solutions.
  • •Collaborate extensively with vendors and internal process integration areas to develop processes that meet integration requirements for current and next-generation 3D NAND.
  • •Own advanced process monitoring and control methodologies and provide the strategic roadmap for N+, N++ and future NAND nodes.

Key Requirements

  • •Masters or PhD with 5-10 years, or Bachelors with 7-12 years of relevant semiconductor industry experience with CMP process in 300mm wafer fabrication.
  • •Hands-on experience operating CMP equipment (including AMAT (LKP) and EBARA-300X) and using optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
  • •Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology, with knowledge of integration and structural impacts across upstream/downstream processes.
  • •Strong oral and written communication skills for concise, effective collaboration across local and remote teams.
  • •Self-driven, adaptable, and able to manage multiple projects, with proven risk-taking to execute novel solutions and mentor/team collaboration ability.
Experience:5-12 yearsSemiconductor industry3D NANDMemory technology
Skills:CommunicationCollaborationMentorshipSelf-drivenProject management
Tech Stack:CMPChemical mechanical planarization3D NANDNANDAMAT (LKP)EBARA-300XOptical metrologyProfilometryPolishing slurriesConditionersPolishing padsDielectricsMetalsFilm depositionDry etchCVDDiffusionLithography3-D NAND nodesData science

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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