SR. HBM Stacking Process Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Problem-solving","Continuous improvement","Quality management","Supplier management"]

Own and improve HBM stacking/assembly process performance by diagnosing assembly-related issues and leading process, equipment, and materials evaluation/optimization. Coordinate continuous yield improvement and cost reduction initiatives, validate and roll out new process baselines for new product introductions, and support manufacturing quality systems and site-to-site portability. Partner with suppliers and support internal/external audits while applying SPC/FDC/RMS/APC and DOE-driven methods to enhance yield and UPH.

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FursaFursa
Micron Technology
Micron Technology
1 year ago

SR. HBM Stacking Process Engineer

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Last checked: 6 hours agoStatus: Live

Job Summary

Own and improve HBM stacking/assembly process performance by diagnosing assembly-related issues and leading process, equipment, and materials evaluation/optimization. Coordinate continuous yield improvement and cost reduction initiatives, validate and roll out new process baselines for new product introductions, and support manufacturing quality systems and site-to-site portability. Partner with suppliers and support internal/external audits while applying SPC/FDC/RMS/APC and DOE-driven methods to enhance yield and UPH.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Identify, diagnose, and resolve assembly process-related problems.
  • •Coordinate and execute process, equipment, and material evaluation/optimization initiatives, implementing changes at the process step.
  • •Lead or participate in continuous yield improvement and cost reduction activities.
  • •Validate and fan out new process baselines qualified, including new process, tools, and/or materials for new product introduction.
  • •Support SPC/FDC/RMS/APC and site-to-site portability; manage and audit material suppliers to meet quality, cost, and risk objectives.

Key Requirements

  • •Over 5 years of working experience in a production line or an engineering background.
  • •Process experience with Flip chip bonding (FCB), Die bond (DB), and Grinding.
  • •Experience with CIP and DOE for yield improvement and UPH enhancement.
  • •English conversation ability with TOEIC 650 score.
  • •Master’s degree or above.
Experience:5+ years
Education:Master's
Skills:Problem-solvingContinuous improvementQuality managementSupplier management
Languages:English
Tech Stack:HBM stackingFlip chip bonding (FCB)Die bond (DB)GrindingCIPDOESPCFDCRMSAPCUPHProcess baselineSite-to-site portability

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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