Principal/Staff Engineer, Process Integration, NTI NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsEducation: mastersSkills: ["Data analysis","Problem-solving","Communication","Cross-functional collaboration","Self-motivation"]

Lead process module ownership for 3D NAND semiconductor coordinated circuits, defining structural specifications and process requirements while setting module direction and continual improvement plans. Drive early identification and resolution of structure, electrical, and reliability issues using model-based approaches. Optimize structural development, electrical performance, parametric verification, and process control, and coordinate experiments and technology transfer from R&D to high-volume manufacturing to improve yield and reliability.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
3 months ago

Principal/Staff Engineer, Process Integration, NTI NAND

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Lead process module ownership for 3D NAND semiconductor coordinated circuits, defining structural specifications and process requirements while setting module direction and continual improvement plans. Drive early identification and resolution of structure, electrical, and reliability issues using model-based approaches. Optimize structural development, electrical performance, parametric verification, and process control, and coordinate experiments and technology transfer from R&D to high-volume manufacturing to improve yield and reliability.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead one or more process modules for development and operation of 3D NAND semiconductor coordinated circuits.
  • •Define structural specifications and process requirements, and set module direction, vision, and continual improvement plans.
  • •Identify and address potential structure, electrical, and reliability issues early using process control and a model-based approach.
  • •Focus on performance optimization across structural development, electrical performance, parametric verification, and process control; optimize manufacturability assessments.
  • •Assemble and coordinate a development team to drive module development, coordinate cross-functional activities, and support technology transfer from R&D to high-volume manufacturing.

Key Requirements

  • •Minimum of 5 years of experience in wafer fabrication process development in dry etch, photolithography, films, wet process, CMP, or process integration.
  • •Strong understanding of process integration (PI) modules on new NAND technologies, including structural and electrical fail mechanisms.
  • •In-depth knowledge and direct experience with non-volatile memories (NAND), including NAND process flow, process-device interaction, and yield/reliability issues.
  • •Experience in R&D and technology transfer to manufacturing, committed to quality, collaboration, and continuous improvement.
  • •Masters/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science, or a related field (or equivalent experience).
Experience:5+ yearsSemiconductorsNANDR&DTechnology transfer
Education:Master's in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science
Skills:Data analysisProblem-solvingCommunicationCross-functional collaborationSelf-motivation
Tech Stack:PythonSolidWorksTableauPower BIModel-based approach

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn