Senior Manager, HBM Customer Integration & System Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 10+ yearsEducation: mastersSkills: ["Communication","Leadership","Problem-solving","Cross-functional collaboration","Executive stakeholder influence"]

Lead and develop teams responsible for HBM customer integration, technical engagement, and system engineering. Drive customer technical interlocks, design reviews, escalations, and integration activities, partnering across design, product, manufacturing, and system engineering to translate requirements into solutions. Provide leadership in HBM architecture, packaging, manufacturing, and customer enablement, establishing scalable engagement models and governing deployments while resolving complex technical issues. Develops and deploys AI systems to automate processes.

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FursaFursa
Micron Technology
Micron Technology
11 hours ago

Senior Manager, HBM Customer Integration & System Engineering

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Last checked: 16 minutes agoStatus: Live

Job Summary

Lead and develop teams responsible for HBM customer integration, technical engagement, and system engineering. Drive customer technical interlocks, design reviews, escalations, and integration activities, partnering across design, product, manufacturing, and system engineering to translate requirements into solutions. Provide leadership in HBM architecture, packaging, manufacturing, and customer enablement, establishing scalable engagement models and governing deployments while resolving complex technical issues. Develops and deploys AI systems to automate processes.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Lead and develop teams for customer integration, technical engagement, and system engineering.
  • •Drive customer technical interlocks, design reviews, escalations, and integration activities.
  • •Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions.
  • •Provide leadership across HBM architecture, system integration, packaging, manufacturing, and customer enablement.
  • •Establish scalable engagement models, governance processes, and executive communications to enable successful deployment and qualification; resolve complex technical issues and influence roadmaps.

Pay and Benefits

Perks:Health InsurancePaid LeaveLearning BudgetWellness StipendEquity

Key Requirements

  • •BS/MS in Electrical Engineering, Computer Engineering, or a related field.
  • •10+ years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience.
  • •Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification.
  • •Proven ability to lead global cross-functional teams and influence executive-level stakeholders and customers.
  • •Excellent communication, leadership, and problem-solving skills.
Experience:10+ yearsSemiconductorSystem integrationCustomer-facing technical leadershipEngineering managementAIHigh-performance computing
Education:Master's in Electrical Engineering, Computer Engineering, or related field
Skills:CommunicationLeadershipProblem-solvingCross-functional collaborationExecutive stakeholder influence
Tech Stack:HBMAIHigh-performance computing

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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