Sr. Product Development Engineer

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: mastersSkills: []

Own CPI-related issues for Micron’s DRAM products from pathfinding through NPI startup into HVM. Create package program plans for new DRAM fab technology process nodes and coordinate end-to-end DRAM device/package/module reviews. Apply deep knowledge of BEOL and memory array/processes, wafer probe and bumping/assembly technologies, and CPI quality & reliability degradation mechanisms to define effective qualification and screening tests.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Sr. Product Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Own CPI-related issues for Micron’s DRAM products from pathfinding through NPI startup into HVM. Create package program plans for new DRAM fab technology process nodes and coordinate end-to-end DRAM device/package/module reviews. Apply deep knowledge of BEOL and memory array/processes, wafer probe and bumping/assembly technologies, and CPI quality & reliability degradation mechanisms to define effective qualification and screening tests.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Own CPI-related issues for Micron’s DRAM products from pathfinding through NPI startup into HVM.
  • •Establish package program plans for new DRAM fab technology process nodes specific to DRAM 3DS products.
  • •Coordinate end-to-end DRAM device/package/module reviews.
  • •Apply knowledge of Fab BEOL, memory array design/processes, wafer probe flows, and wafer/device bumping & flip chip assembly technologies.
  • •Use CPI quality and reliability degradation knowledge to design effective qualification plans and screening tests.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysParental Leave

Key Requirements

  • •Master’s degree in Material Science Engineering, Chemical Engineering, Metallurgical Engineering, Electrical Engineering, Physics, or related field.
  • •60 months of experience in the job offered or in an Engineering-related occupation.
  • •Demonstrated knowledge of DRAM/NAND memory device structure and function.
  • •Understanding of chip-package-interaction (CPI), including assembly process effects, package design, and design decision influences.
  • •Ability to design quality and reliability qualification plans using DRAM/NAND CPI quality and reliability degradation mechanisms, accelerated reliability stress tests, and sampling statistics.
Experience:SemiconductorsDRAMNANDMemory technologyNPIHVM
Education:Master's

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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