Package Health Analyst

Micron Technology
Hyderabad
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceEducation: bachelorsSkills: ["Cross-functional collaboration","Problem-solving","Documentation","Statistical thinking","Analytical reasoning"]

Develop and execute package health monitoring, simulation, and characterization to ensure robust semiconductor packaging. Define health metrics, detection mechanisms, and monitoring dashboards; perform electrical/mechanical characterization and inline defect classification. Drive advanced analytics to link process variables and defect patterns to reliability outcomes, and maintain a structured knowledge base for NPI handover. Establish end-to-end traceability across wafer, assembly, and test with data pipelines and tooling that connect process parameters, equipment signals, and defect signatures.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

Package Health Analyst

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Develop and execute package health monitoring, simulation, and characterization to ensure robust semiconductor packaging. Define health metrics, detection mechanisms, and monitoring dashboards; perform electrical/mechanical characterization and inline defect classification. Drive advanced analytics to link process variables and defect patterns to reliability outcomes, and maintain a structured knowledge base for NPI handover. Establish end-to-end traceability across wafer, assembly, and test with data pipelines and tooling that connect process parameters, equipment signals, and defect signatures.
Location: Hyderabad
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Define quantitative package health metrics and develop monitoring dashboards for continuous health assessment.
  • •Perform electrical and mechanical characterization of packages.
  • •Implement real-time defect detection and classification, with advanced characterization for critical defects and integration into predictive models.
  • •Conduct correlation and causation studies between process variables, defect patterns, and reliability outcomes.
  • •Collaborate to establish end-to-end traceability across wafer, assembly, and test, including building data pipelines linking process parameters, equipment signals, and defect signatures.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or a related field.
  • •3+ years of experience in the semiconductor industry, preferably in packaging, test, or reliability engineering.
  • •Strong data analytics and statistical modeling skills.
  • •Proficiency in Python/R for data analysis and visualization (plus).
  • •Ability to work cross-functionally with process, equipment, and reliability teams.
Experience:Semiconductor industrySemiconductor packagingReliability engineeringSemiconductor test
Education:Bachelor's
Skills:Cross-functional collaborationProblem-solvingDocumentationStatistical thinkingAnalytical reasoning
Tech Stack:PythonR

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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