Mechanical Simulation Engineer – Advanced Packaging

Micron Technology
Hyderabad
Workplace: OnsiteFull timeFunction: Field Service, Maintenance & Skilled TradesExperience: 2-5 yearsSkills: ["Cross-functional collaboration","Predictive analysis","Automation mindset","Data-driven thinking"]

Drive thermo-mechanical and multiphysics modeling to enable robust advanced semiconductor package design. Perform linear/non-linear static, fatigue, fracture, and reliability simulations while developing models covering thermal, structural, fluidic effects and complex interfaces. Accelerate simulation workflows by integrating generative AI/AI assistant capabilities and AI/ML techniques such as surrogate and reduced-order modeling. Collaborate with global teams across package architecture, fabrication, and assembly integration.

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FursaFursa
Micron Technology
Micron Technology
16 hours ago

Mechanical Simulation Engineer – Advanced Packaging

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Last checked: 5 hours agoStatus: Live

Job Summary

Drive thermo-mechanical and multiphysics modeling to enable robust advanced semiconductor package design. Perform linear/non-linear static, fatigue, fracture, and reliability simulations while developing models covering thermal, structural, fluidic effects and complex interfaces. Accelerate simulation workflows by integrating generative AI/AI assistant capabilities and AI/ML techniques such as surrogate and reduced-order modeling. Collaborate with global teams across package architecture, fabrication, and assembly integration.
Location: Hyderabad
Workplace: Onsite
Employment Type: Full time
Job Function: Field Service, Maintenance & Skilled Trades
Seniority: Mid level

Key Responsibilities

  • •Perform linear and non-linear static analysis for package and material behavior.
  • •Run fatigue, fracture mechanics, and reliability simulations for advanced packages.
  • •Develop multiphysics models (thermo-mechanical, thermal, structural, fluidic) including contact, shear, delamination, and interfacial damage.
  • •Integrate generative AI/AI assistant tools and AI/ML techniques to accelerate simulations and improve predictive analytics.
  • •Develop automation workflows for simulation setup, solve, and post-processing; apply data-driven methods to increase model fidelity and reduce turnaround time.

Key Requirements

  • •2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging domains.
  • •Experience in AI-driven modeling, automation, or data-driven simulation techniques.
  • •Ability to perform linear and non-linear static analysis for package and material behavior.
  • •Experience with fatigue, fracture mechanics, and reliability simulations for advanced packages.
  • •Knowledge of semiconductor/advanced packaging processes and technologies such as HBM, 2.5D/3D integration, TSV, and hybrid bonding.
Experience:2-5 yearsSemiconductorAdvanced packagingAI/MLAutomation
Skills:Cross-functional collaborationPredictive analysisAutomation mindsetData-driven thinking
Tech Stack:Generative AIAI Assistant toolsArtificial IntelligenceAI/MLSurrogate modelingReduced-order modelingAutomation workflowsHBM2.5D3D integrationTSVHybrid bondingThermo-compression bondingReflowWafer bondingThermo-mechanical modelingMultiphysics modelsFatigue lifeCrack propagation

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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