PRINCIPAL ENGINEER – FE OCT CPEE HVM DRY ETCH

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Analytical skills","Continuous improvement","Sound judgment","Cross-functional collaboration","Safety focus"]

Lead and strategize productivity, yield, quality, and cost improvements for Dry Etch modules across Micron’s global wafer fabrication fleet. Diagnose and resolve process-related line problems using failure analysis, FMEA, 8D, and SPC, while building process and hardware CIP roadmaps. Drive defect reduction and recipe robustness, partner with suppliers for equipment start-up acceptance, and implement IoT/FDC telemetry and excursion prevention for chamber-health monitoring with a strong focus on safety and sustainability.

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Micron Technology
Micron Technology
3 weeks ago

PRINCIPAL ENGINEER – FE OCT CPEE HVM DRY ETCH

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live
Reposted: first listed 13 hours ago

Job Summary

Lead and strategize productivity, yield, quality, and cost improvements for Dry Etch modules across Micron’s global wafer fabrication fleet. Diagnose and resolve process-related line problems using failure analysis, FMEA, 8D, and SPC, while building process and hardware CIP roadmaps. Drive defect reduction and recipe robustness, partner with suppliers for equipment start-up acceptance, and implement IoT/FDC telemetry and excursion prevention for chamber-health monitoring with a strong focus on safety and sustainability.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Strategize and lead productivity, yield, quality, and cost improvement engagements with global sites via plasma process optimization, chemistry & hardware qualification, and CIP development collaboration with dry etch suppliers.
  • •Diagnose and resolve process-related problems using failure analysis, FMEA, 8D, or SPC methodologies, including troubleshooting wafer fabrication problems and root cause analysis.
  • •Drive process and hardware improvement focused on safety, defect reduction, cost efficiency, throughput, quality, and sustainability across Dry Etch modules.
  • •Develop the Dry Etch process and hardware CIP roadmap covering chamber parts, RF/match networks, gas delivery, ESC, endpoint, and plasma source upgrades; establish chamber qualification flows and tool service requirements with suppliers.
  • •Establish and improve process windows and recipe robustness, upgrade process capability (e.g., CD, profile, selectivity, ARDE, LER/LWR control), and implement IoT/FDC sensor telemetry for excursion prevention and chamber-health monitoring.

Key Requirements

  • •Bachelor's or Master's degree in Engineering (Chemical, Electrical, Materials), Physics, Materials Science, or related field, or equivalent experience.
  • •Extensive experience in semiconductor dry etch equipment and process management (e.g., LAM Kiyo/Flex/Vantex/Versys, TEL Tactras/RK, AMAT Sym3/Centura, or equivalent).
  • •Proven track record establishing plasma process parameters and maturing tool performance for dry etch equipment.
  • •Experience with abnormal analysis and improvement (FDC, SPC excursions, chamber-matching deviations) with successful project implementation across DRAM and/or NAND flows.
  • •Strong ability to develop and implement hardware CIP roadmaps and start-up acceptance criteria for dry etch chambers and consumable parts.
Experience:Semiconductor manufacturingDry etchDRAMNAND
Education:Bachelor's
Skills:Analytical skillsContinuous improvementSound judgmentCross-functional collaborationSafety focus
Tech Stack:Dry etchPlasma process optimizationFMEA8DSPCFDCIoTAdvanced chamber telemetryExcursion preventionMAXOUT-style productivity programsIoT/FDC sensorsCD controlProfile controlLER/LWR controlRF power optimizationEco-modePFC abatementF-gas abatementLAM KiyoFlex

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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