Senior Manager, HBM Customer Integration Technical Leader

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceEducation: mastersSkills: ["Technical mentorship","Communication","Collaboration","Root-cause analysis","Technical problem-solving"]

Serve as a key technical interface between external customers and internal engineering teams for advanced HBM product integrations. Lead customer-facing discussions, translate system-level requirements into actionable needs across front-end/back-end engineering and manufacturing, and drive design reviews, failure analysis, and yield improvement efforts. Provide technical mentorship on HBM architecture and packaging, and develop/deploy AI-driven systems to automate integration workflows, debug, characterization, and customer enablement.

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Micron Technology
Micron Technology
1 week ago

Senior Manager, HBM Customer Integration Technical Leader

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Source: Company careers pageValidated by: Fursa AI
Last checked: 12 hours agoStatus: Live

Job Summary

Serve as a key technical interface between external customers and internal engineering teams for advanced HBM product integrations. Lead customer-facing discussions, translate system-level requirements into actionable needs across front-end/back-end engineering and manufacturing, and drive design reviews, failure analysis, and yield improvement efforts. Provide technical mentorship on HBM architecture and packaging, and develop/deploy AI-driven systems to automate integration workflows, debug, characterization, and customer enablement.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Sr. Manager level

Key Responsibilities

  • •Develop a strong understanding of customer system architecture, application requirements, and integration challenges.
  • •Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams.
  • •Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies.
  • •Lead root-cause analysis for integration issues and propose design or process optimizations to improve integration success.
  • •Work across front-end/back-end process engineering, product development, and manufacturing, and develop/deploy AI systems to automate integration workflows and customer enablement.

Pay and Benefits

Perks:MedicalDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •10+ years in semiconductor product engineering, system integration, or customer-facing technical roles.
  • •Bachelor’s or Master’s degree (or equivalent experience) in Electrical Engineering, Computer Engineering, or a related technical field.
  • •Hands-on experience with HBM architecture, packaging, and manufacturing processes.
  • •Ability to interpret customer system-level requirements and map them to internal design and process capabilities.
  • •Excellent communication and collaboration skills across technical and non-technical teams.
Experience:SemiconductorSystem integrationManufacturingAI
Education:Master's in Electrical Engineering, Computer Engineering, or related technical field
Skills:Technical mentorshipCommunicationCollaborationRoot-cause analysisTechnical problem-solving
Tech Stack:HBMArtificial intelligence (AI)

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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