Principal Diffusion Process Development Engineer, DRAM

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 4+ yearsEducation: phdSkills: ["Technical leadership","Analytical thinking","Communication","Cross-functional collaboration","Independent project leadership"]

Lead FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM technology. Drive gate dielectric scaling with a focus on electrical performance, reliability, variability, and manufacturability, from concept through integration and manufacturing transfer. Partner across process R&D, device, equipment, and manufacturing teams, evaluate reactor and equipment platforms, run and analyze experiments, and translate characterization data into decisions—while contributing technical documentation and IP.

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Micron Technology
Micron Technology
4 months ago

Principal Diffusion Process Development Engineer, DRAM

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Job Summary

Lead FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM technology. Drive gate dielectric scaling with a focus on electrical performance, reliability, variability, and manufacturability, from concept through integration and manufacturing transfer. Partner across process R&D, device, equipment, and manufacturing teams, evaluate reactor and equipment platforms, run and analyze experiments, and translate characterization data into decisions—while contributing technical documentation and IP.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Sr. Manager level

Key Responsibilities

  • •Lead FEOL diffusion, thermal treatment, and gate oxidation operations for advanced DRAM technology.
  • •Develop and scale ultra-thin gate dielectrics, balancing electrical performance, reliability, variability, and manufacturability.
  • •Own the interaction between process conditions, materials behavior, and diffusion hardware.
  • •Drive process development from concept through integration, pilot qualification, and manufacturing transfer.
  • •Define and monitor manufacturing metrics such as SPC, process capability, defectivity, and variability, and plan/analyze built experiments.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •PhD in Chemical Engineering, Materials Science, Chemistry, Physics, Electrical Engineering, or a closely related field with 4+ years of experience.
  • •Strong background in device physics, especially MOS device behavior.
  • •Extensive knowledge of diffusion and oxidation principles, including thermal processing, reaction kinetics, dopant behavior/activation, and interface/defect control.
  • •Practical experience working with diffusion and oxidation equipment in lab or cleanroom settings.
  • •Demonstrated ability to scale processes to manufacturing readiness, including SPC and process control, with strong analytical and communication skills.
Experience:4+ yearsDRAMSemiconductorsProcess developmentManufacturing readiness
Education:PhD / Doctorate
Skills:Technical leadershipAnalytical thinkingCommunicationCross-functional collaborationIndependent project leadership
Tech Stack:SPCStatistical process controlTEMSIMSXPSAFMSEMEllipsometryElectrical measurements

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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