AMD

1 month ago

Packaging Engineer (based in Kaohsiung)

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Last checked: 6 hours agoStatus: Live

Job Summary

Collaborate with oSATs and cross-functional teams to bring up and sustain InFO, EFB/CoWoS-L, CoWoS-S, WLFO, FCBGA, LGA and chiplet packaging. Drive manufacturing readiness, packaging yield and cost improvements, and supplier management, while standardizing assembly processes and coordinating cross-organizational activities.

Location: Taiwan

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

•Lead manufacturing readiness for new packaging technologies (InFO, CoWoS-L/CoWoS-S, WLFO, FCBGA, LGA, Chiplet) at the manufacturing site
•Drive packaging yield, quality, cost and operation productivity improvements and sustaining activities
•Standardize assembly process baselines and drive continuous improvement
•Coordinate packaging interaction activities among assembly, bump, 3D IC, HBM, wafer fab, wafer sort, Functional Test and Mark/Pack
•Collaborate with Packaging BU on NPI and Ramp Up readiness; manage supplier performance and report status to stakeholders

Key Requirements

•8+ years’ experience in InFO or 2.5D/3D Bump/TSV/Packaging, Flip Chip BGA/LGA or WLFO process engineering with min total 7 years assembly work experience
•Strong technical knowledge in InFO, Chiplet packaging, 2.5D/3D TSV/Packaging, and Chip-Packaging Interaction
•Excellent cross-functional project management and interpersonal communication skills; fluent English
•Bachelor’s or MS degree in Mechanical, Materials or Chemical Engineering
•Experience with DOE and JMP; strategic supplier management experience

Experience:8+ yearsSemiconductor packagingInFOChiplet packaging3D packagingTSVAssembly

Education:Bachelor's

Skills:CommunicationLeadershipProject management

Languages:English

Tech Stack:InFOCoWoSWLFOFCBGALGAChiplet3D packagingTSV

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD