Advanced Packaging Senior Yield Analysis

Intel
Albuquerque
Workplace: HybridFull timeUSD 164,470 - 232,190 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 2+ yearsEducation: bachelorsSkills: ["Analytical skills","Data analysis","Problem-solving","Communication","Organizational skills"]

Drive yield and defect improvement across Advanced Packaging Technology and Manufacturing (APTM) packaging technologies by extracting insights from large structured and unstructured datasets. Apply statistical methods and machine learning to connect electrical/physical failures, inline defect metrology, and manufacturing/test flows. Produce clear yield and device-health reports, influence the yield improvement roadmap, and partner cross-functionally through technology development and HVM ramp, with some domestic and international travel.

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Intel
Intel
5 days ago

Advanced Packaging Senior Yield Analysis

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Last checked: 14 hours agoStatus: Live

Job Summary

Drive yield and defect improvement across Advanced Packaging Technology and Manufacturing (APTM) packaging technologies by extracting insights from large structured and unstructured datasets. Apply statistical methods and machine learning to connect electrical/physical failures, inline defect metrology, and manufacturing/test flows. Produce clear yield and device-health reports, influence the yield improvement roadmap, and partner cross-functionally through technology development and HVM ramp, with some domestic and international travel.
Location: Albuquerque
Workplace: Hybrid
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Extract insights from large structured and unstructured datasets using statistical methods and machine learning to drive yield and defect improvement.
  • •Analyze relationships between electrical and physical failures using tools/process knowledge such as FIFA, DFT, Sort/Test, and integration/process flow.
  • •Apply understanding of inline defect metrology, detection capabilities, and underlying defect systems to improve yield.
  • •Partner with Process Engineering, Integration, QNR, and Product/Test Development Engineering to support technology development, transfer, and ramp into HVM.
  • •Prepare timely yield and device-health reports and determine actions needed to deliver best-in-class yield levels, influencing the yield improvement roadmap.
Travel: Medium travel

Pay and Benefits

Salary: USD 164,470 - 232,190 annually
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •Bachelor’s (6+ years), Master’s (4+ years), or PhD (2+ years) in relevant fields such as materials science, mechanical, computer science, information systems, chemical, electrical, chemistry, or physics.
  • •3+ years’ experience in data analysis using JMP, Python, or other data engineering software.
  • •In-depth understanding and hands-on application of statistical analysis.
  • •Demonstrated proficiency in structured technical problem-solving.
  • •Understanding of inline defect metrology capabilities and how they relate to yield analysis.
Experience:2+ yearsManufacturingData analysisMachine learningInline metrology
Education:Bachelor's
Skills:Analytical skillsData analysisProblem-solvingCommunicationOrganizational skills
Tech Stack:JMPPythonMachine learningStatistical analysisDataminingDatabasesData manipulationData visualizationFIFADFTSort/Test

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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