MEMS Fab Process Development Engineer (Dry Etch)

HP
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 2-5 yearsEducation: mastersSkills: ["Analytical problem-solving","Technical documentation","Communication","Presentation","Cross-functional collaboration"]

Own and sustain dry etch processes for silicon and oxide etching modules to support high-volume manufacturing and NPI. Drive process optimization to improve yield, defectivity, and robustness using data analysis, DOE, and continuous improvement. Investigate excursions and implement corrective/preventive actions, while developing SPC/OCAPs and process documentation. Collaborate with equipment, manufacturing, quality, and product teams to characterize, qualify, and release new process changes, and train technicians on operation and troubleshooting.

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FursaFursa
HP
HP
1 month ago

MEMS Fab Process Development Engineer (Dry Etch)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Own and sustain dry etch processes for silicon and oxide etching modules to support high-volume manufacturing and NPI. Drive process optimization to improve yield, defectivity, and robustness using data analysis, DOE, and continuous improvement. Investigate excursions and implement corrective/preventive actions, while developing SPC/OCAPs and process documentation. Collaborate with equipment, manufacturing, quality, and product teams to characterize, qualify, and release new process changes, and train technicians on operation and troubleshooting.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Own and sustain dry etch processes for silicon and oxide etching modules supporting high-volume manufacturing and NPI.
  • •Drive process optimization to reduce defects, improve yield, and enhance process robustness using data analysis, DOE, and continuous improvement.
  • •Investigate process excursions, yield loss, and defectivity issues using structured problem-solving and implement corrective and preventive actions.
  • •Develop and maintain process control plans, SPC monitoring, OCAPs, specifications, and related process documentation.
  • •Lead process characterization, qualification, and release activities for new products, materials, consumables, and process changes, and support process transfer and integration.

Key Requirements

  • •Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field.
  • •Minimum 2–5 years of hands-on semiconductor wafer fab experience in dry etch process engineering.
  • •Strong knowledge of plasma etching fundamentals, especially silicon etch and oxide etch, with experience in process development and characterization.
  • •Experience supporting high-volume manufacturing with demonstrated yield improvement and defect reduction projects.
  • •Experience with process troubleshooting methodologies such as 8D, DMAIC, or root cause analysis, plus knowledge of process control/monitoring (FDC/APC/SPC) as advantageous.
Experience:2-5 yearsSemiconductor wafer fabricationDry etchHigh-volume manufacturingNPI
Education:Master's
Skills:Analytical problem-solvingTechnical documentationCommunicationPresentationCross-functional collaboration
Tech Stack:Dry etchPlasma etchingDOESPCOCAPsFDCAPC8DDMAIC

Company Brief

HP
Designs and manufactures personal computers, printers, and related supplies, as well as provides software, services, and solutions for consumers and enterprises worldwide.
Industry: Hardware Devices
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Palo Alto, United States
Founded: 1939
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Glassdoor: 3.8
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