5 days ago

MEMS Fab Process Development Engineer (Dry Etch)

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Job Summary

Own and sustain dry etch processes for silicon and oxide etching modules to support high-volume manufacturing and new product introduction. Drive process optimization, defect reduction, yield improvement, and robustness using data analysis, DOE, and continuous improvement. Troubleshoot excursions with structured problem-solving, maintain process control plans and SPC monitoring, and lead characterization, qualification, and release for new materials and process changes. Collaborate across process integration, manufacturing, equipment, quality, and product development.

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Own and sustain dry etch processes for silicon and oxide etching modules to support high-volume manufacturing and NPI.
•Improve process performance (yield, defectivity, capability, throughput) through data analysis, DOE, and continuous improvement.
•Investigate process excursions and yield loss/defectivity issues using structured methodologies, then implement corrective and preventive actions.
•Develop and maintain process control plans, SPC monitoring, OCAPs, specifications, and process documentation.
•Lead process characterization, qualification, and release for new products, materials, consumables, and process changes; support process transfer and integration across teams.

Key Requirements

•Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related discipline.
•2–5 years of hands-on semiconductor wafer fab experience in dry etch process engineering.
•Strong knowledge of plasma etching fundamentals, especially silicon etch and oxide etch, including profile control.
•Experience with process development and characterization using DOE, SPC, and statistical data analysis.
•Experience supporting high-volume manufacturing, including yield improvement and defect reduction projects.

Experience:2-5 yearsSemiconductor manufacturingWafer fab

Skills:Analytical problem-solvingTechnical documentationCommunicationCollaborationProactive mindset

Tech Stack:Dry etchPlasma etchingSilicon etchOxide etchDOESPCOCAPsFDCAPC8DDMAICRoot cause analysisProcess control plansProcess monitoringYield improvementDefect reduction

Company Brief

Designs and manufactures personal computers, printers, and related supplies, as well as provides software, services, and solutions for consumers and enterprises worldwide.

Industry: Hardware Devices

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Palo Alto, United States

Founded: 1939

Glassdoor: 3.8

Website LinkedIn

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