GPM Intern

Applied Materials
Singapore
Workplace: OnsiteFull timeFunction: Product ManagementSkills: ["Analysis","Market research","Communication"]

Support market and customer strategy by analyzing industry trends from key semiconductor and technology sources, mapping customer requirements to product capabilities, and identifying opportunities for growth. Help surface pain points in advanced packaging processes (e.g., thermal dissipation and via-last/3D heterogeneous integration) and contribute to decision-ready deliverables including a customer requirement database, gap analysis matrix, and roadmap prioritization model for management reviews.

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FursaFursa
Applied Materials
Applied Materials
5 days ago

GPM Intern

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Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Support market and customer strategy by analyzing industry trends from key semiconductor and technology sources, mapping customer requirements to product capabilities, and identifying opportunities for growth. Help surface pain points in advanced packaging processes (e.g., thermal dissipation and via-last/3D heterogeneous integration) and contribute to decision-ready deliverables including a customer requirement database, gap analysis matrix, and roadmap prioritization model for management reviews.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Intern level

Key Responsibilities

  • •Analyze industry trends to inform market and product planning.
  • •Map market positions and identify growth opportunities.
  • •Gather and categorize customer requirements from external sources and internal teams.
  • •Analyze advanced packaging pain points (thermal dissipation, via-last integration, 3D heterogeneous integration).
  • •Create deliverables including a customer requirement database, gap analysis matrix, roadmap prioritization model, and management review presentation.

Pay and Benefits

Perks:Travel Allowance

Key Requirements

  • •Analyze industry trends from semiconductor and technology publications and sources.
  • •Map current market positions and identify opportunities to grow.
  • •Collect and categorize customer requirements from external resources and internal partners (product managers and account teams).
  • •Analyze pain points in advanced packaging processes such as thermal dissipation, via-last integration, and 3D heterogeneous integration.
  • •Map customer requirements against existing product capabilities.
Experience:SemiconductorsAdvanced packaging
Skills:AnalysisMarket researchCommunication

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
Glassdoor
Glassdoor: 3.9
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