Senior Signal Integrity Engineer – Cryogenic Interconnects

NVIDIA
United States
Workplace: OnsiteFull timeUSD 168,000 - 264,500 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Cross-functional collaboration","Signal integrity modeling","Simulation","Lab validation","Systems understanding"]

Develop accurate 3D electromagnetic (EM) models and simulate multi-layer PCB designs under cryogenic conditions to define signal integrity constraints, SI specifications, and design guidelines. Work on next-generation cryogenic interconnects for ultra-high-speed communication, performing lab characterization with network analyzers and correlating hardware measurements to improve modeling accuracy. Collaborate across signal integrity, materials, mixed-signal, and system teams to drive end-to-end performance across PCB, package, and system domains.

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FursaFursa
NVIDIA
NVIDIA
2 months ago

Senior Signal Integrity Engineer – Cryogenic Interconnects

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Source: Company careers pageValidated by: Fursa AI
Last checked: 12 hours agoStatus: Live

Job Summary

Develop accurate 3D electromagnetic (EM) models and simulate multi-layer PCB designs under cryogenic conditions to define signal integrity constraints, SI specifications, and design guidelines. Work on next-generation cryogenic interconnects for ultra-high-speed communication, performing lab characterization with network analyzers and correlating hardware measurements to improve modeling accuracy. Collaborate across signal integrity, materials, mixed-signal, and system teams to drive end-to-end performance across PCB, package, and system domains.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop accurate 3D EM models for PCB and interconnect structures using tools such as HFSS.
  • •Simulate multi-layer PCB designs under cryogenic conditions.
  • •Define high-speed constraints, SI specifications, and design guidelines across RF, materials, and thermal domains.
  • •Perform lab characterization and validation using network analyzers and other measurement tools.
  • •Correlate simulation results with hardware measurements to improve modeling accuracy and contribute to system-level understanding across PCB, package, and system domains.

Pay and Benefits

Salary: USD 168,000 - 264,500 annually
Equity and Bonus:Equity

Key Requirements

  • •MS/PhD in Electrical Engineering or equivalent experience.
  • •5+ years of experience.
  • •Strong signal integrity modeling and simulation experience using HFSS or similar EM tools.
  • •Deep understanding of high-frequency/broadband design and signal behavior in multi-layer PCBs.
  • •Experience with lab characterization and validation using VNA and other high-speed measurement tools.
Experience:5+ yearsCryogenic technologiesSignal integrityHigh-speed interconnectsRFMulti-layer PCBExtreme environments
Education:Master's in Electrical Engineering
Skills:Cross-functional collaborationSignal integrity modelingSimulationLab validationSystems understanding
Tech Stack:HFSSVNANetwork analyzers3D EM modelingRFPCBMulti-layer PCBEM tools

Company Brief

NVIDIA
Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1993
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