Senior Signal Integrity Engineer – Cryogenic Interconnects

Develop accurate 3D electromagnetic (EM) models and simulate multi-layer PCB designs under cryogenic conditions to define signal integrity constraints, SI specifications, and design guidelines. Work on next-generation cryogenic interconnects for ultra-high-speed communication, performing lab characterization with network analyzers and correlating hardware measurements to improve modeling accuracy. Collaborate across signal integrity, materials, mixed-signal, and system teams to drive end-to-end performance across PCB, package, and system domains.