Module Development Engineer - LTD Dry Etch

Intel
United States
Workplace: HybridFull timeUSD 133,800 - 255,200 annuallyFunction: Product ManagementSkills: ["Collaboration","Problem-solving","Technical communication","Technical leadership","Mentorship"]

Develop and advance next-generation patterning and LTD dry etch processes for high-volume semiconductor manufacturing. Partner with cross-functional teams to solve complex process, equipment, yield, and defect challenges; drive feasibility studies, characterization plans, and DOE-based optimization. Own process architecture, qualification methodologies, and sustainment control systems (SPC/control plans/alarms/recipe governance), improving yield, reliability, cost, and manufacturability while mentoring and aligning stakeholders.

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Intel
Intel
1 day ago

Module Development Engineer - LTD Dry Etch

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Job Summary

Develop and advance next-generation patterning and LTD dry etch processes for high-volume semiconductor manufacturing. Partner with cross-functional teams to solve complex process, equipment, yield, and defect challenges; drive feasibility studies, characterization plans, and DOE-based optimization. Own process architecture, qualification methodologies, and sustainment control systems (SPC/control plans/alarms/recipe governance), improving yield, reliability, cost, and manufacturability while mentoring and aligning stakeholders.
Location: United States
Workplace: Hybrid
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Drive technology development for future technology and high-volume manufacturing, providing process integration and equipment solutions and performing feasibility studies.
  • •Own and develop next-generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
  • •Conduct pathfinding to support process and hardware development on existing and first-of-kind equipment, enabling innovative device architectures.
  • •Lead cross-functional problem solving for complex process and defect issues using structured root-cause, containment, and permanent corrective actions.
  • •Design and execute characterization plans and establish control systems (SPC, control plans, alarms, response plans, recipe governance) to sustain production performance and improve yield, reliability, cost, productivity, and process capability.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •PhD or Master’s (or Bachelor’s with 4+ years) in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related semiconductor STEM field with relevant research/industry experience.
  • •Hands-on experience in dry etch semiconductor manufacturing with ownership of process development and optimization.
  • •Experience with plasma etch fundamentals including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
  • •Experience delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability.
  • •Expertise in statistical analysis and DOE methodologies using tools such as JMP, Python, or MATLAB.
Experience:Semiconductor manufacturingDry etchFoundryPlasma etchProcess developmentAdvanced logic
Education:
Skills:CollaborationProblem-solvingTechnical communicationTechnical leadershipMentorship
Tech Stack:JMPPythonMATLABDOESPCSEMTEMAFMXPSCD SEMICPCCPHARCALE

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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