Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Manufacturing & Production OperationsExperience: 8+ yearsEducation: mastersSkills: ["Leadership","Problem-solving","Root-cause analysis","Communication","Collaboration"]

Lead Media Health Manufacturing efforts for next-generation HBM products, driving media health KPIs across quality, cost, cycle time, and scale. Own manufacturing test flow development, validation, and test coverage optimization, improving device/stacked yield through deep circuit debug and reliability-focused strategy. Support new product design validation using CAD and Verilog simulations, mentor team members, and coordinate cross-functional engineering partners to deliver qualified, cost-effective manufacturing-ready systems.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 14 hours agoStatus: Live

Job Summary

Lead Media Health Manufacturing efforts for next-generation HBM products, driving media health KPIs across quality, cost, cycle time, and scale. Own manufacturing test flow development, validation, and test coverage optimization, improving device/stacked yield through deep circuit debug and reliability-focused strategy. Support new product design validation using CAD and Verilog simulations, mentor team members, and coordinate cross-functional engineering partners to deliver qualified, cost-effective manufacturing-ready systems.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Manufacturing & Production Operations
Seniority: Sr. Manager level

Key Responsibilities

  • •Spearhead optimized manufacturing test coverage for current and future HBM design architectures and process nodes for high-volume manufacturing efficiency.
  • •Develop, validate, characterize, and qualify next-generation HBM products to ensure reliability and market readiness.
  • •Support design verification and in-depth circuit work for new products using CAD tools and Verilog simulations.
  • •Improve manufacturing test yields and reduce test time by resolving yield-related issues for DRAM, interface, and stacked die; drive DFT strategy to improve cost, cycle time, and quality.
  • •Collaborate across Fab, product leads, design, technology development, and test solution engineering; mentor others and lead risk analysis and project prioritization.

Pay and Benefits

Equity and Bonus:Equity
Perks:Paid LeaveLearning BudgetWellness StipendHealth InsuranceEquityRecognition

Key Requirements

  • •Bachelors/Masters in Electrical and Electronics Engineering with 8+ years of semiconductor industry experience, with product engineering experience preferred.
  • •Demonstrated leadership skills with strong problem-solving using root-cause understanding and in-depth circuit analysis.
  • •Good knowledge of statistics, data analysis tools, and scripting.
  • •Ability to adapt in a dynamic environment, including leading the team and technical programs.
  • •Strong collaboration across teams to address sophisticated engineering problems; strong communication and presentation skills.
Experience:8+ yearsSemiconductor industryProduct engineering
Education:Master's in Electrical and Electronics Engineering
Skills:LeadershipProblem-solvingRoot-cause analysisCommunicationCollaboration
Tech Stack:CADVerilogArtificial Intelligence

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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