Hybrid Bonding Technology Development Engineer (Wet Clean)

Design, collect, and analyze data from hybrid bonding enablement process engineering experiments for display and semiconductor manufacturing. Measure film and surface properties, optimize processes, and perform hardware characterization to push performance to hardware limits. Troubleshoot complex issues using root-cause analysis, document results, and generate technical reports. Partner with vendors and R&D teams, guide prototyping, and communicate with customers to resolve process concerns under limited supervision.