Hybrid Bonding Technology Development Engineer (Wet Clean)

Applied Materials
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsSkills: ["Problem-solving","Innovation","Troubleshooting","Root cause analysis","Communication"]

Design, collect, and analyze data from hybrid bonding enablement process engineering experiments for display and semiconductor manufacturing. Measure film and surface properties, optimize processes, and perform hardware characterization to push performance to hardware limits. Troubleshoot complex issues using root-cause analysis, document results, and generate technical reports. Partner with vendors and R&D teams, guide prototyping, and communicate with customers to resolve process concerns under limited supervision.

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Applied Materials
Applied Materials
2 months ago

Hybrid Bonding Technology Development Engineer (Wet Clean)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live

Job Summary

Design, collect, and analyze data from hybrid bonding enablement process engineering experiments for display and semiconductor manufacturing. Measure film and surface properties, optimize processes, and perform hardware characterization to push performance to hardware limits. Troubleshoot complex issues using root-cause analysis, document results, and generate technical reports. Partner with vendors and R&D teams, guide prototyping, and communicate with customers to resolve process concerns under limited supervision.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Design, collect data, analyze results, and compile reports from complex process engineering experiments.
  • •Measure film and surface properties, interpret data, and optimize processes to push product performance to hardware limits.
  • •Generate ideas to tackle challenges in hybrid bonding enablement and guide engineering on prototyping.
  • •Perform hardware characterization, implement new technologies/products/instrumentation, and troubleshoot complex problems with root-cause analysis.
  • •Create internal documentation and communicate with customers; partner with vendors and serve as a resource for junior colleagues.
Travel: Low travel

Key Requirements

  • •PhD/ Master or Bachelor Degree in Engineering.
  • •More than 5 years of process development experience, particularly on wet clean module.
  • •Strong conceptual and practical expertise in complex problem solving.
  • •Innovation mindset with iterative process/hardware development testing and learning cycles.
  • •Ability to perform hardware characterization and troubleshoot difficult process engineering issues.
Experience:5+ yearsSemiconductorDisplayProcess developmentWet cleanHybrid bonding
Education:
Skills:Problem-solvingInnovationTroubleshootingRoot cause analysisCommunication
Tech Stack:AutomationAnalytical instrumentation

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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