SpaceX

3 months ago

Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Lead end-to-end silicon packaging development for Starlink’s advanced electronics. Own wafer-level and chip-level packaging processes, drive NPI/NTI programs, select equipment and materials, and collaborate with IC design, materials, thermal, and production teams to deliver reliable, cost-effective packaging solutions for SpaceX’s next-generation products.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

•Own packaging assembly processes from concept to mass production including equipment and material selection for wafer-level and chip-level systems
•Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach
•Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
•Own packaging prototypes, product development and release to production
•Select equipment and material to meet quality, reliability, cost, yield, and production targets

Key Requirements

•Bachelor’s degree in electrical, mechanical, chemical engineering, materials science, physics or related engineering discipline;
•5+ years of professional experience in semiconductor assembly and packaging;
•Strong hands-on packaging experience and familiarity with wafer-level and chip-level processes;
•Ability to lead packaging development from concept to mass production, including equipment and material selection;
•Experience with NPI/NTI introductions and cross-functional collaboration with IC design, materials, thermal, and production teams

Experience:5+ yearsSemiconductorPackagingHardware

Education:Bachelor's

Skills:Problem-solvingCommunicationCollaborationLeadershipAttention to detail

Languages:English

Tech Stack:Wafer grindingWafer dicingLithographyLaminationPlatingEtchingSMTFlip chipBondingMoldingUnderfillDispenseSputterLid attachSolder ball attach

Eligibility

Nationality:US National

Work Authorization:Authorization required. Sponsorship not provided.

Security Clearance:ITAR

Company Brief

SpaceX

Designs, manufactures, and launches advanced rockets and spacecraft for commercial and government customers, aiming to reduce space transportation costs and enable human life on Mars through reusable launch vehicles and integrated space systems.

Industry: Aerospace Manufacturing

Company Size: Enterprise (1,001+ employees)

Growth: Established Company

Valuation: Hectocorn (USD 100B+)

Funding: Series E+

Headquarters: Hawthorne, United States

Founded: 2002

Glassdoor: 4.2

Website LinkedIn

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SpaceX

3 months ago

Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

•Own packaging assembly processes from concept to mass production including equipment and material selection for wafer-level and chip-level systems
•Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach
•Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
•Own packaging prototypes, product development and release to production
•Select equipment and material to meet quality, reliability, cost, yield, and production targets

Key Requirements

•Bachelor’s degree in electrical, mechanical, chemical engineering, materials science, physics or related engineering discipline;
•5+ years of professional experience in semiconductor assembly and packaging;
•Strong hands-on packaging experience and familiarity with wafer-level and chip-level processes;
•Ability to lead packaging development from concept to mass production, including equipment and material selection;
•Experience with NPI/NTI introductions and cross-functional collaboration with IC design, materials, thermal, and production teams

Experience:5+ yearsSemiconductorPackagingHardware

Education:Bachelor's

Skills:Problem-solvingCommunicationCollaborationLeadershipAttention to detail

Languages:English

Tech Stack:Wafer grindingWafer dicingLithographyLaminationPlatingEtchingSMTFlip chipBondingMoldingUnderfillDispenseSputterLid attachSolder ball attach

Eligibility

Nationality:US National

Work Authorization:Authorization required. Sponsorship not provided.

Security Clearance:ITAR

Company Brief

SpaceX

Industry: Aerospace Manufacturing

Company Size: Enterprise (1,001+ employees)

Growth: Established Company

Valuation: Hectocorn (USD 100B+)

Funding: Series E+

Headquarters: Hawthorne, United States

Founded: 2002

Glassdoor: 4.2

Website LinkedIn