Sr. Manager, Package Design/Development Quality Assurance

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: QA, Test & Release EngineeringExperience: 10+ yearsSkills: ["Technical leadership","People leadership","Mentoring","Cross-functional collaboration","Analytical thinking"]

Lead Package Design/Development Quality Assurance in Micron’s Global Quality organization, guiding a specialized engineering team to identify and mitigate package-level interaction, reliability, and customer integration risks early. Own DDQA strategy for advanced package technology introductions, define characterization and reliability test approaches, drive root-cause analysis and closure, and capture lessons learned for next-generation designs. Partner with technology development, design, assembly, and customer-facing teams to advance both near-term quality and long-term package technology impact.

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Micron Technology
Micron Technology
4 months ago

Sr. Manager, Package Design/Development Quality Assurance

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Last checked: 13 hours agoStatus: Live

Job Summary

Lead Package Design/Development Quality Assurance in Micron’s Global Quality organization, guiding a specialized engineering team to identify and mitigate package-level interaction, reliability, and customer integration risks early. Own DDQA strategy for advanced package technology introductions, define characterization and reliability test approaches, drive root-cause analysis and closure, and capture lessons learned for next-generation designs. Partner with technology development, design, assembly, and customer-facing teams to advance both near-term quality and long-term package technology impact.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: QA, Test & Release Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Lead DDQA strategy for new package technology introductions, focusing on package interaction (CPI) and customer integration risks.
  • •Drive early identification and mitigation of package-level reliability and interaction issues, including root-cause analysis and closure of quality problems.
  • •Define and oversee characterization and reliability test strategies, guiding technical trade-offs across teams.
  • •Lead, mentor, and develop a highly technical DDQA engineering team with clear performance goals and development plans.
  • •Own resource planning and DDQA performance metrics; improve processes, tools, and execution while ensuring compliance with training, safety, and ethical standards.

Key Requirements

  • •10+ years of experience in package technology, assembly engineering, product quality/reliability engineering, and/or failure analysis.
  • •Demonstrated ability to lead and develop senior technical engineers.
  • •Strong knowledge of semiconductor package assembly and surface-mount processes.
  • •Solid understanding of thermomechanical, thermal, mechanical, and hygroscopic stress effects on package reliability.
  • •Experience using FMEA and structured problem-solving methods (e.g., 8D) to drive root-cause analysis and closure.
Experience:10+ yearsSemiconductorsPackage technologyAssembly engineeringProduct qualityReliability engineeringFailure analysis
Skills:Technical leadershipPeople leadershipMentoringCross-functional collaborationAnalytical thinking
Tech Stack:FMEA8DRoot cause analysisReliability test methodsAcceleration modelsSampling statistics

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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