Intel

2 weeks ago

Advanced Packaging Dry Etch Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 14 hours agoStatus: Live

Job Summary

Develop and optimize plasma dry etch processes for next-generation semiconductor advanced packaging, including 2.5D/3D integration, chiplet packaging, and heterogeneous integration. Design DOE studies to define process windows, execute technology roadmaps, and partner with equipment suppliers to implement innovative solutions. Continuously improve production efficiency, yield, and manufacturing methods by modifying equipment and collaborating cross-functionally with yield and operations stakeholders.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Develop and optimize plasma etch processes for advanced packaging applications.
•Design DOE studies to characterize process windows and optimize etch performance.
•Develop and execute technology roadmaps to meet future manufacturing needs.
•Partner with equipment suppliers to design, test, and implement process solutions.
•Monitor and improve production efficiency and yield, and implement modifications to reduce costs and enhance output.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Master’s or PhD in Materials Science & Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
•Master’s degree with at least 4 years of experience, or PhD with at least 2 years of experience.
•Process development engineering in semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
•Experience with Design of Experiments (DOE), process development methodology, and/or statistical process control or manufacturing process improvement.
•Experience with plasma etch equipment platforms.

Experience:2+ yearsSemiconductor manufacturingAdvanced packagingWafer-level assembly

Education:

Skills:Cross-functional collaborationTechnical leadershipProgram leadershipProblem-solving

Tech Stack:Plasma etchDry etch processesDesign of Experiments (DOE)Statistical process control

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

2 weeks ago

Advanced Packaging Dry Etch Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 14 hours agoStatus: Live

Job Summary

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Develop and optimize plasma etch processes for advanced packaging applications.
•Design DOE studies to characterize process windows and optimize etch performance.
•Develop and execute technology roadmaps to meet future manufacturing needs.
•Partner with equipment suppliers to design, test, and implement process solutions.
•Monitor and improve production efficiency and yield, and implement modifications to reduce costs and enhance output.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Master’s or PhD in Materials Science & Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
•Master’s degree with at least 4 years of experience, or PhD with at least 2 years of experience.
•Process development engineering in semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
•Experience with Design of Experiments (DOE), process development methodology, and/or statistical process control or manufacturing process improvement.
•Experience with plasma etch equipment platforms.

Experience:2+ yearsSemiconductor manufacturingAdvanced packagingWafer-level assembly

Education:

Skills:Cross-functional collaborationTechnical leadershipProgram leadershipProblem-solving

Tech Stack:Plasma etchDry etch processesDesign of Experiments (DOE)Statistical process control

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor