DDP/Epitaxy Module Process Engineer

Applied Materials
South Korea
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringSkills: ["Technical leadership","Data-driven analysis","Complex problem solving","Cross-functional collaboration","Executive-level communication"]

Provide technical leadership for semiconductor display and chip equipment projects, partnering across Sales, Hardware, and Process Development to shape customer proposals and proposals’ technology advantages. Serve as a deep process authority for thin film technologies (CVD/ALD/PVD/Epitaxy), lead data-driven analysis of equipment and process performance, and resolve complex tool/process issues. Communicate executive-level value with customer-specific data while influencing cross-functional teams and developing engineering talent.

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FursaFursa
Applied Materials
Applied Materials
19 hours ago

DDP/Epitaxy Module Process Engineer

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Job Summary

Provide technical leadership for semiconductor display and chip equipment projects, partnering across Sales, Hardware, and Process Development to shape customer proposals and proposals’ technology advantages. Serve as a deep process authority for thin film technologies (CVD/ALD/PVD/Epitaxy), lead data-driven analysis of equipment and process performance, and resolve complex tool/process issues. Communicate executive-level value with customer-specific data while influencing cross-functional teams and developing engineering talent.
Location: South Korea
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Provide technical leadership throughout the pre-sales lifecycle, partnering with Sales, Hardware, and Process Development to shape proposals and highlight technology advantages.
  • •Lead deep technical engagements with customers to understand fab environments, process nodes (Logic, DRAM, NAND), roadmaps, and critical KPIs.
  • •Perform advanced data-driven analysis of equipment and process performance versus specifications (e.g., CD, profile, defectivity, yield, Cpk, matching, output, CoO).
  • •Own resolution of highly complex, cross-disciplinary tool and process issues and lead continuous improvement projects to ensure sustainable implementation and replication.
  • •Influence and enable cross-functional teams without direct authority, mentor engineers, and deliver technical presentations articulating differentiation and quantifiable business impact.
Travel: Medium travel

Key Requirements

  • •Demonstrated system-level integration knowledge across semiconductor process modules.
  • •Deep expert-level knowledge in one or more thin film process areas across CVD/ALD/PVD/Epitaxy.
  • •Ability to operate independently in ambiguous, high-impact customer environments and influence outcomes at technical and leadership levels.
  • •Proven ability to mentor and develop engineers through structured technical guidance, coaching, and knowledge transfer.
Experience:SemiconductorsMaterials engineeringThin filmManufacturing
Skills:Technical leadershipData-driven analysisComplex problem solvingCross-functional collaborationExecutive-level communication
Tech Stack:EpitaxyThin filmCVDALDPVDCDDefectivityYieldProcess capability (Cpk)Cost of Ownership (CoO)

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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