Mechanical Engineering Technical Leader || Electro-mechanical Packaging || CREO, FEA || DFM/DFA || ASIC System Integration || Exp - 11+ years

Cisco
Bengaluru
Workplace: HybridFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 11+ yearsEducation: bachelorsSkills: ["Mentoring","Leadership","Documentation","Data management","Self-motivation","Interpersonal skills","Communication","Partnership"]

Own electro-mechanical packaging and system integration for next-generation telecom and datacentre products. Drive architecture, implementation, and verification across FPGA/ASIC-related workflows, including early ASIC characterization and defining system-level integration. Create and improve design/methodology guidelines, support subsystem lab bring-up and unit validation, and mentor a technical team. Use tools like CREO/UG-NX and structural simulation to deliver robust, first-pass RTL and integration outcomes.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Cisco
Cisco
1 day ago

Mechanical Engineering Technical Leader || Electro-mechanical Packaging || CREO, FEA || DFM/DFA || ASIC System Integration || Exp - 11+ years

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Own electro-mechanical packaging and system integration for next-generation telecom and datacentre products. Drive architecture, implementation, and verification across FPGA/ASIC-related workflows, including early ASIC characterization and defining system-level integration. Create and improve design/methodology guidelines, support subsystem lab bring-up and unit validation, and mentor a technical team. Use tools like CREO/UG-NX and structural simulation to deliver robust, first-pass RTL and integration outcomes.
Location: Bengaluru
Workplace: Hybrid
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Sr. Manager level

Key Responsibilities

  • •Design and develop next-generation telecom and datacentre products.
  • •Participate in architecture definition, implementation, and verification.
  • •Collaborate with the ASIC team during initial characterisation and define system-level integration based on inputs.
  • •Develop and implement process/design improvement guidelines aligned to the latest design methodology.
  • •Support complex subsystem lab bring-up, integration, and unit test validation; mentor the team and help them upskill.

Key Requirements

  • •11+ years of hands-on experience designing telecom & datacentre products with MTech/BTech in Mechanical Engineering.
  • •Experience with solid modeling tools such as Creo and UG-NX.
  • •Hands-on experience with structural simulation tools such as Ansys.
  • •Mentoring and leading a technical team; people management experience is an advantage.
  • •Knowledge of system thermal and current cooling methodologies and limitations.
Experience:11+ years
Education:Bachelor's in Mechanical Engineering
Skills:MentoringLeadershipDocumentationData managementSelf-motivationInterpersonal skillsCommunicationPartnership
Languages:English
Tech Stack:FPGARTLFPGA functional specificationImage generationValidationCREOUG-NXAnsysASICDFM/DFASystem thermalCooling methodologiesAI tools

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
Glassdoor
Glassdoor: 4.0
WebsiteLinkedInGlassdoor